Inventor · disambiguated record

Chun-An Kung

Also filed as: KUNG CHUN-AN

2 granted patents·0 citations·filing 2020–2022

27Inventor score

Technology areasH10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD2

Top patents by PatentIndex Score

2 records

0163US12227865B2Plating apparatus and method for electroplating waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
0257US11401624B2Plating apparatus and method for electroplating waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →