Inventor · disambiguated record
Cheng-Yuan Kung
Also filed as: KUNG CHENG-YUAN
28 granted patents·15 pending applications·22 citations·filing 2017–2025
93Inventor score
Files withADVANCED SEMICONDUCTOR ENG43
Top patents by PatentIndex Score
43 records- 0195US11798890B2Assembly structure and package structureADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Oct 24, 2023·2 cites·6 claims
- 0288US11756896B2Semiconductor package structure including shielding layer contacting conductive contactADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Sep 12, 2023·2 cites·15 claims
- 0384US11502067B2Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 15, 2022·3 cites·15 claims
- 0483US10475718B2Semiconductor device package comprising a dielectric layer with built-in inductorADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 12, 2019·5 cites·18 claims
- 0582US11508668B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Nov 22, 2022·1 cites·11 claims
- 0682US10211137B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Feb 19, 2019·3 cites·18 claims
- 0780US11348885B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 31, 2022·2 cites·18 claims
- 0878US2025349725A1Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 0977US11296043B2Semiconductor device packages and methods of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 5, 2022·2 cites·19 claims
- 1076US2025234680A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1175US12272766B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Apr 8, 2025·0 cites·16 claims
- 1275US10490341B2Electrical deviceADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 26, 2019·2 cites·22 claims
- 1374US2023403078A1System comprising packaged optical devicesADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 1473US11935841B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Mar 19, 2024·0 cites·15 claims
- 1571US12368104B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 22, 2025·0 cites·16 claims
- 1671US12051658B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 30, 2024·0 cites·14 claims
- 1770US11722220B2System comprising packaged optical devicesADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 8, 2023·0 cites·10 claims
- 1869US12463157B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Nov 4, 2025·0 cites·20 claims
- 1968US12218075B2Package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Feb 4, 2025·0 cites·18 claims
- 2067US2023075336A1Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 2166US11594660B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 28, 2023·0 cites·13 claims
- 2265US2025183197A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 2363US10903907B1System comprising packaged optical devicesADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 26, 2021·0 cites·17 claims
- 2462US12513815B2Electronic device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 2561US11233010B2Assembly structure and package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 25, 2022·0 cites·19 claims
- 2657US11923825B2Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Mar 5, 2024·0 cites·1 claims
- 2757US2024371711A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 2856US10475734B2Semiconductor device packageADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 12, 2019·0 cites·20 claims
- 2956US2024304555A1Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 3056US2024304584A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 3155US11784111B2Semiconductor device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 10, 2023·0 cites·15 claims
- 3255US11037846B2Semiconductor package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jun 15, 2021·0 cites·17 claims
- 3355US2024373752A1Semiconductor substrate and package structure including the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 3454US2025226364A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 3553US2023420395A1Electronic devicesADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 3652US2023326889A1Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 3750US2023065615A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2021·Application pending·0 cites
- 3850US2023077877A1Photonic package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Application pending·0 cites
- 3948US10472228B2MEMS device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 12, 2019·0 cites·20 claims
- 4047US11189604B2Device assembly structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Nov 30, 2021·0 cites·9 claims
- 4146US11545427B2Capacitor bank structure and semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jan 3, 2023·0 cites·1 claims
- 4246US2022157709A1Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Application pending·0 cites
- 4338US11201125B2Semiconductor package and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Dec 14, 2021·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →