Inventor · disambiguated record
Chia-Pang Kuo
Also filed as: KUO CHIA-PANG
16 granted patents·12 pending applications·20 citations·filing 2015–2025
88Inventor score
Top patents by PatentIndex Score
28 records- 0194US11676898B2Diffusion barrier for semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 13, 2023·4 cites·16 claims
- 0285US12354958B2Semiconductor devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 8, 2025·1 cites·21 claims
- 0378US12315809B2Via for semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 0478US12068194B2Selective deposition of metal barrier in damascene processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 0578US2025357337A1Interconnection structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0677US2025279364A1Via for semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0776US2024363403A1Selective deposition of metal barrier in damascene processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0873US11398406B2Selective deposition of metal barrier in damascene processesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 26, 2022·2 cites·20 claims
- 0972US11837500B2Selective deposition of metal barrier in damascene processes and the structures formed thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 1072US2024387381A1Semiconductor devices and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1170US2025259889A1Interconnect Structure of Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1267US12322649B2Interconnect structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 3, 2025·0 cites·20 claims
- 1367US2024321733A1Interconnection structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1466US11810857B2Via for semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 7, 2023·0 cites·20 claims
- 1564US11183424B2Barrier layer formation for conductive featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 23, 2021·0 cites·19 claims
- 1664US11043416B2Gradient atomic layer depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 22, 2021·0 cites·20 claims
- 1764US11043413B2Barrier layer formation for conductive featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 22, 2021·0 cites·19 claims
- 1864USD845226SElectrode of a solar cell substrateNEO SOLAR POWER CORP·Filed 2015·Granted Apr 9, 2019·13 cites·1 claims
- 1964US2022367376A1Diffusion Barrier for Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2060US10741442B2Barrier layer formation for conductive featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 11, 2020·0 cites·20 claims
- 2156US10672652B2Gradient atomic layer depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·0 cites·20 claims
- 2255US11527476B2Interconnect structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 13, 2022·0 cites·20 claims
- 2355US2024304551A1Aluminum structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2453US2025167046A1Vias with selected grain distributionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2550US2023042277A1Semiconductor processing tool and method for passivation layer formation and removalTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2636US9923102B2Solar cellNEO SOLAR POWER CORP·Filed 2015·Granted Mar 20, 2018·0 cites·7 claims
- 2736US2016284883A1Solar cell with rear side multi-layer anti-reflection coatingNEO SOLAR POWER CORP·Filed 2016·Application pending·0 cites
- 2826US2016300963A1Solar cell and fabrication method thereofNEO SOLAR POWER CORP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →