Inventor · disambiguated record
Che-Hung Kuo
Also filed as: KUO CHE-HUNG
17 granted patents·12 pending applications·30 citations·filing 2016–2024
89Inventor score
Files withMEDIATEK INC29
Top patents by PatentIndex Score
29 records- 0197US11710688B2Semiconductor package structureMEDIATEK INC·Filed 2021·Granted Jul 25, 2023·6 cites·20 claims
- 0292US10847869B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2018·Granted Nov 24, 2020·9 cites·23 claims
- 0392US10636773B2Semiconductor package structure and method for forming the sameMEDIATEK INC·Filed 2016·Granted Apr 28, 2020·11 cites·19 claims
- 0484US12300679B2Semiconductor package structureMEDIATEK INC·Filed 2022·Granted May 13, 2025·1 cites·19 claims
- 0575US9818727B2Semiconductor package assembly with passive deviceMEDIATEK INC·Filed 2016·Granted Nov 14, 2017·2 cites·38 claims
- 0671US12165961B2Semiconductor package structureMEDIATEK INC·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 0769US10199318B2Semiconductor package assemblyMEDIATEK INC·Filed 2017·Granted Feb 5, 2019·1 cites·28 claims
- 0865US11908759B2Semiconductor deviceMEDIATEK INC·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 0964US11721882B2Semiconductor package having discrete antenna deviceMEDIATEK INC·Filed 2020·Granted Aug 8, 2023·0 cites·14 claims
- 1062US2025105237A1Semiconductor package assemblyMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1160US2024332266A1Semiconductor deviceMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1259US12230560B2Semiconductor package structureMEDIATEK INC·Filed 2021·Granted Feb 18, 2025·0 cites·19 claims
- 1359US11908767B2Semiconductor package structureMEDIATEK INC·Filed 2021·Granted Feb 20, 2024·0 cites·18 claims
- 1458US2024063078A1Semiconductor package structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1557US12230622B2Electronic device with stacked printed circuit boardsMEDIATEK INC·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 1657US10468341B2Semiconductor package assemblyMEDIATEK INC·Filed 2018·Granted Nov 5, 2019·0 cites·28 claims
- 1757US2023307421A1Package-on-package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1857US2023422525A1Semiconductor package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1957US2025105184A1Electronic deviceMEDIATEK INC·Filed 2024·Application pending·0 cites
- 2057US2024079308A1Semiconductor package assemblyMEDIATEK INC·Filed 2023·Application pending·0 cites
- 2156US11776899B2Via array design for multi-layer redistribution circuit structureMEDIATEK INC·Filed 2021·Granted Oct 3, 2023·0 cites·19 claims
- 2254US2024096861A1Semiconductor package assemblyMEDIATEK INC·Filed 2023·Application pending·0 cites
- 2353US10497678B2Semiconductor package assembly with passive deviceMEDIATEK INC·Filed 2017·Granted Dec 3, 2019·0 cites·2 claims
- 2453US2023050400A1Semiconductor package with reduced connection lengthMEDIATEK INC·Filed 2022·Application pending·0 cites
- 2552US2023116326A1Semiconductor package with tsv dieMEDIATEK INC·Filed 2022·Application pending·0 cites
- 2649US11887976B2Land-side silicon capacitor design and semiconductor package using the sameMEDIATEK INC·Filed 2021·Granted Jan 30, 2024·0 cites·10 claims
- 2749US2018102298A1Semiconductor deviceMEDIATEK INC·Filed 2017·Application pending·0 cites
- 2848US12021013B2Ball pad design for semiconductor packagesMEDIATEK INC·Filed 2021·Granted Jun 25, 2024·0 cites·25 claims
- 2937US2018053665A1Pre-bumped redistribution layer structure and semiconductor package incorporating such pre-bumped redistribution layer structureMEDIATEK INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →