Inventor · disambiguated record
Chen-Cheng Kuo
Also filed as: KUO CHEN-CHENG
97 granted patents·7 pending applications·1,322 citations·filing 1997–2024
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD38TAIWAN SEMICONDUCTOR MFG34CHUANG YAO-CHUN7KUO CHEN-CHENG7CHEN CHIH-HUA5
Top patents by PatentIndex Score
104 records- 0199US8227902B2Structures for preventing cross-talk between through-silicon vias and integrated circuitsKUO CHEN-CHENG·Filed 2007·Granted Jul 24, 2012·136 cites·19 claims
- 0299US7564115B2Tapered through-silicon via structureTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 21, 2009·155 cites·15 claims
- 0398US8278152B2Bonding process for CMOS image sensorLIU JEN-CHENG·Filed 2009·Granted Oct 2, 2012·129 cites·19 claims
- 0498US7973413B2Through-substrate via for semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jul 5, 2011·132 cites·15 claims
- 0597US10163858B1Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·18 cites·20 claims
- 0697US8476769B2Through-silicon vias and methods for forming the sameCHEN CHIH-HUA·Filed 2007·Granted Jul 2, 2013·67 cites·27 claims
- 0797US7969013B2Through silicon via with dummy structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jun 28, 2011·32 cites·10 claims
- 0897US7843064B2Structure and process for the formation of TSVsTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Nov 30, 2010·75 cites·18 claims
- 0997US7816227B2Tapered through-silicon via structureTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Oct 19, 2010·45 cites·20 claims
- 1095US9224688B2Metal routing architecture for integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Dec 29, 2015·17 cites·20 claims
- 1195US8299616B2T-shaped post for semiconductor devicesCHUANG YAO-CHUN·Filed 2010·Granted Oct 30, 2012·24 cites·20 claims
- 1294US10304700B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 28, 2019·10 cites·24 claims
- 1394US9881885B2Metal routing architecture for integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 30, 2018·11 cites·19 claims
- 1494US8829673B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 9, 2014·17 cites·20 claims
- 1594US8049327B2Through-silicon via with scalloped sidewallsTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 1, 2011·30 cites·20 claims
- 1694US8034708B2Structure and process for the formation of TSVsTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Oct 11, 2011·13 cites·21 claims
- 1793US7514797B2Multi-die wafer level packagingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Apr 7, 2009·22 cites·19 claims
- 1892US12094728B2Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·1 cites·20 claims
- 1992US8901736B2Strength of micro-bump jointsShen wen-wei·Filed 2010·Granted Dec 2, 2014·15 cites·20 claims
- 2092US8232643B2Lead free solder interconnections for integrated circuitsCHUANG YAO-CHUN·Filed 2010·Granted Jul 31, 2012·12 cites·20 claims
- 2192US6319821B1Dual damascene approach for small geometry dimensionTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Nov 20, 2001·66 cites·3 claims
- 2290US10861710B2Methods of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·5 cites·20 claims
- 2390US10510644B2Package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·4 cites·20 claims
- 2490US9768138B2Improving the strength of micro-bump jointsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 19, 2017·6 cites·19 claims
- 2589US8659170B2Semiconductor device having conductive pads and a method of manufacturing the sameKUO CHEN-CHENG·Filed 2010·Granted Feb 25, 2014·9 cites·21 claims
- 2688US9093440B2Connector structures of integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 28, 2015·6 cites·20 claims
- 2787US12218001B2Semiconductor package and method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
- 2887US10937688B2Semiconductor package and method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 2, 2021·2 cites·15 claims
- 2987US8193639B2Dummy metal design for packaging structuresLIU TZUAN-HORNG·Filed 2010·Granted Jun 5, 2012·8 cites·20 claims
- 3086US12125741B2Semiconductor package and method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 3186US9397059B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jul 19, 2016·4 cites·20 claims
- 3286US9257412B2Stress reduction apparatusCHUANG YAO-CHUN·Filed 2012·Granted Feb 9, 2016·6 cites·16 claims
- 3386US8598030B2Process for making conductive post with footing profileKUO CHEN-CHENG·Filed 2010·Granted Dec 3, 2013·7 cites·19 claims
- 3485US9472521B2Scheme for connector site spacing and resulting structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Oct 18, 2016·7 cites·14 claims
- 3585US9129818B2Semiconductor device having conductive pads and a method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Sep 8, 2015·6 cites·20 claims
- 3684US10276428B2Semiconductor package and method of fabricating semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·18 claims
- 3784US8202800B2Method of forming through silicon via with dummy structureCHEN CHIH-HUA·Filed 2011·Granted Jun 19, 2012·6 cites·20 claims
- 3883US9786617B2Chip packages and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 10, 2017·4 cites·20 claims
- 3983US9679836B2Package structures and methods for forming the sameHSIAO CHING-WEN·Filed 2011·Granted Jun 13, 2017·4 cites·19 claims
- 4083US9673161B2Bonded structures for package and substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 6, 2017·3 cites·20 claims
- 4183US8653648B2Zigzag pattern for TSV copper adhesionCHEN CHIH-HUA·Filed 2008·Granted Feb 18, 2014·8 cites·18 claims
- 4282US10515917B2Bump on pad (BOP) bonding structure in semiconductor packaged deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 4382US9991218B2Connector structures of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 5, 2018·2 cites·20 claims
- 4481US8227924B2Substrate stand-offs for semiconductor devicesSHEN CHENG HUNG·Filed 2010·Granted Jul 24, 2012·9 cites·20 claims
- 4580US11961791B2Package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·0 cites·20 claims
- 4680US8604594B2Structures for preventing cross-talk between through-silicon vias and integrated circuitsKUO CHEN-CHENG·Filed 2012·Granted Dec 10, 2013·4 cites·19 claims
- 4780US8546941B2Multi-direction design for bump pad structuresCHEN CHIH-HUA·Filed 2010·Granted Oct 1, 2013·4 cites·14 claims
- 4880US2024105654A1Method of making semiconductor device and semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4979US9905524B2Bump structures in semiconductor device and packaging assemblyCHUANG CHITA·Filed 2011·Granted Feb 27, 2018·4 cites·20 claims
- 5079US9053989B2Elongated bump structure in semiconductor deviceKUO CHEN-CHENG·Filed 2011·Granted Jun 9, 2015·5 cites·20 claims
Showing the top 50 of 104 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →