Inventor · disambiguated record
Cheng-Yu Kuo
Also filed as: KUO CHENG-YU
15 granted patents·12 pending applications·8 citations·filing 2013–2025
87Inventor score
Top patents by PatentIndex Score
27 records- 0184US12424449B2CMP system and method of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 0284US2025364303A1Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0383US11069533B2CMP system and method of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 20, 2021·2 cites·20 claims
- 0482US10163849B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 0582US2025347870A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0677US12441097B2Lamination process, and manufacturing method of semiconductor package using a chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 0775US12391033B2Lamination process, and manufacturing method of semiconductor package using a chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 0875US2025093593A1Optical device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0973US12500113B2Workpiece chuck, workpiece handling apparatus, manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·14 claims
- 1072US11984323B2CMP system and method of useTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 1170US11569183B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·20 claims
- 1270US11069652B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 20, 2021·0 cites·20 claims
- 1370US2023115449A1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1467US11993066B2Chuck, lamination process, and manufacturing method of semiconductor package using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 28, 2024·0 cites·20 claims
- 1563US10535629B2Method of manufacturing semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 14, 2020·0 cites·20 claims
- 1663US2025383260A1Inspection tool for fiber array unit (fau) quality monitoring in the co-packaged optics application and methods for inspecting using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1760US10867939B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·0 cites·20 claims
- 1860US2025389915A1Optical engine module with fiber array unit and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1960US2025316599A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2059US2025172774A1Photonic system with removable fiber array unit assembly and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2159US2025147245A1Package assembly and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2258US2025172777A1Co-packaged optics device and opto-electronic moduleTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2357US2024387150A1Plasma etching system having focus ring with prolonged lifetimeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2455US9017234B2Water resistance upper body reciprocating exerciserUNIV SOUTHERN TAIWAN SCI & TEC·Filed 2013·Granted Apr 28, 2015·2 cites·10 claims
- 2554US9799625B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 24, 2017·0 cites·20 claims
- 2654US9017233B2Water resistance lower body reciprocating exerciserUNIV SOUTHERN TAIWAN SCI & TEC·Filed 2013·Granted Apr 28, 2015·2 cites·10 claims
- 2742US2015279686A1Semiconductor processing methodsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →