Inventor · disambiguated record
Chilwoo Kwon
Also filed as: KWON CHILWOO
3 granted patents·2 pending applications·2 citations·filing 2019–2024
51Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0162US11264339B2Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 1, 2022·1 cites·14 claims
- 0259US10985091B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 20, 2021·1 cites·20 claims
- 0355US2025029886A1Semiconductor package including thermal interfacial material patternsSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0454US2025046755A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0542US11728283B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Chilwoo Kwon files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →