Inventor · disambiguated record
Chil Woo Kwon
Also filed as: KWON CHIL WOO
1 granted patent·4 pending applications·0 citations·filing 2009–2024
4Inventor score
Top patents by PatentIndex Score
5 records- 0151US2024413096A1Semiconductor package comprising stiffener structureSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0245US2011089138A1Method of manufacturing printed circuit boardKO YOUNG GWAN·Filed 2009·Application pending·0 cites
- 0336US11171107B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 9, 2021·0 cites·19 claims
- 0431US2015223341A1Embedded board, printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 0530US2016374198A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →