Inventor · disambiguated record

Chia-Ping Lai

Also filed as: LAI CHIA-PING

82 granted patents·38 pending applications·84 citations·filing 2004–2025

98Inventor score

Technology areasH10W H10F G02B H10D H10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD116 ACADEMIA SININCA1 SHAW JEI-FU1 TSENG SHYANG-MING1 WANG CHIN-CHUNG1

Top patents by PatentIndex Score

120 records

0198US11862610B2Fan-out packages providing enhanced mechanical strength and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·5 cites·20 claims
0298US11855130B2Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·9 cites·17 claims
0398US11728288B2Semiconductor die including guard ring structure and three-dimensional device structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·5 cites·20 claims
0497US12230613B2Vertical semiconductor package including horizontally stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·3 cites·11 claims
0597US12027475B2Semiconductor die including guard ring structure and three-dimensional device structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 2, 2024·3 cites·20 claims
0697US11437332B2Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·4 cites·20 claims
0797US10546917B1Trench capacitor layout structure and method of forming same backgroundTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 28, 2020·22 cites·20 claims
0896US12057467B2Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 6, 2024·2 cites·18 claims
0996US11894411B2Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 6, 2024·2 cites·20 claims
1094US11940659B2Optical integrated circuit structure including edge coupling protective features and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 26, 2024·2 cites·20 claims
1194US11862609B2Semiconductor die including fuse structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·2 cites·17 claims
1293US11892678B2Photonic device and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
1392US11410927B2Semiconductor structure and method for forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 9, 2022·2 cites·20 claims
1492US10777591B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 15, 2020·4 cites·21 claims
1591US11940662B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 26, 2024·2 cites·20 claims
1691US11515355B2Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 29, 2022·2 cites·20 claims
1791US2025349800A1Fan-out packages providing enhanced mechanical strength and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
1890US11488993B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·2 cites·20 claims
1990US11175452B1Photonic device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 16, 2021·2 cites·20 claims
2090US2025344525A1Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2190US2025349757A1Semiconductor Die Including Guard Ring Structure and Three Dimensional Device Structure Including the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2289US12364028B2Image sensor device and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
2389US11327228B2Photonic device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·2 cites·20 claims
2489US2025359368A1Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
2588US12009349B2Vertical semiconductor package including horizontally stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 11, 2024·1 cites·20 claims
2688US2025140754A1Fan-out packages providing enhanced mechanical strength and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
2787US12417987B2Semiconductor die including guard ring structure and three-dimensional device structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 16, 2025·0 cites·20 claims
2887US12068262B2Semiconductor package including neighboring die contact and seal ring structures, and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 20, 2024·1 cites·20 claims
2987US12015010B2Vertically stacked semiconductor device including a hybrid bond contact junction circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·1 cites·20 claims
3086US11581400B2Method of making a trench capacitor and trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·1 cites·20 claims
3185US2025140686A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
3284US12431467B2Fan-out packages providing enhanced mechanical strength and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 30, 2025·0 cites·20 claims
3384US2025314843A1Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3483US12439713B2Image sensor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
3583US12379557B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
3683US12353034B2Optical integrated circuit structure including edge coupling protective features and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
3783US12272724B2Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
3883US12224268B2Fan-out packages providing enhanced mechanical strength and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
3983US12218049B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·0 cites·20 claims
4083US2024387618A1Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4183US2024371841A1Vertical semiconductor package including horizontally stacked dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4282US2025306309A1Optical integrated circuit structure including edge coupling protective features and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4381US11626442B2Methods for forming image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 11, 2023·1 cites·20 claims
4481US2025110283A1Optical coupling systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4581US2025085476A1Photonic device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4681US2025070060A1Package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4780US12169308B2Method of using fiber to chip coupler and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
4880US12094925B1Three-dimensional device structure including embedded integrated passive device and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
4980US11329125B2Integrated circuit including trench capacitorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 10, 2022·2 cites·20 claims
5080US2025151376A1Device including mim capacitor and resistorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites

Showing the top 50 of 120 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →