Inventor · disambiguated record
Chung-Hung Lai
Also filed as: LAI CHUNG-HUNG
3 granted patents·1 pending application·1 citations·filing 2020–2023
47Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG4
Top patents by PatentIndex Score
4 records- 0177US11621217B2Substrate structure and semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 4, 2023·1 cites·17 claims
- 0252US2024413115A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 0350US11855034B2Electronic device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Dec 26, 2023·0 cites·13 claims
- 0446US11798907B2Semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 24, 2023·0 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →