Inventor · disambiguated record
Chia-Chu Lai
Also filed as: LAI CHIA-CHU
27 granted patents·6 pending applications·27 citations·filing 2012–2025
93Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD30CHUANG MIN-HAN2SILICONW ARE PREC INDUSTRIES CO LTD1
Top patents by PatentIndex Score
33 records- 0196US12068211B2Electronic package comprising multiple wires inside an electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Aug 20, 2024·4 cites·9 claims
- 0296US12068535B2Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Aug 20, 2024·4 cites·37 claims
- 0396US12014967B2Manufacturing method of electronic package comprising a wire within an electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Jun 18, 2024·4 cites·10 claims
- 0496US11728234B2Electronic package comprising wire inside an electronic component and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Aug 15, 2023·6 cites·9 claims
- 0593US12368081B2Electronic package comprising conductive layer connected electrode pad through electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Jul 22, 2025·1 cites·11 claims
- 0686US12293952B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted May 6, 2025·0 cites·10 claims
- 0786US2024379477A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0883US12438266B2Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·39 claims
- 0982US12100633B2Electronic package comprising wire inside an electronic componentSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·14 claims
- 1076US9196941B2Cross-coupled bandpass filterCHUANG MIN-HAN·Filed 2012·Granted Nov 24, 2015·6 cites·6 claims
- 1174US12100648B2Electronic module, manufacturing method thereof and electronic package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Sep 24, 2024·0 cites·9 claims
- 1272US12500145B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·20 claims
- 1371US2025285952A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2025·Application pending·0 cites
- 1470US12334425B2Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2022·Granted Jun 17, 2025·0 cites·20 claims
- 1570US12057618B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2023·Granted Aug 6, 2024·0 cites·20 claims
- 1666US11776897B2Electronic module, manufacturing method thereof and electronic package having the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·16 claims
- 1763US11682826B2Electronic package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·17 claims
- 1861US2025300047A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 1956US10840965B2Test systemSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2020·Granted Nov 17, 2020·0 cites·7 claims
- 2056US9281557B2Multi bandwidth balun and circuit structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 8, 2016·1 cites·30 claims
- 2155US9054670B2Cross-coupled bandpass filterCHUANG MIN-HAN·Filed 2012·Granted Jun 9, 2015·1 cites·6 claims
- 2254US10659097B1Testing systemSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted May 19, 2020·0 cites·8 claims
- 2349US12027753B2Electronic package and antenna structure thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2021·Granted Jul 2, 2024·0 cites·20 claims
- 2449US9698090B2Semiconductor substrate and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Jul 4, 2017·0 cites·8 claims
- 2548US11081776B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2019·Granted Aug 3, 2021·0 cites·12 claims
- 2647US11670607B2Electronic packageSILICONW ARE PREC INDUSTRIES CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·16 claims
- 2745US2017271251A1Fabrication method of semiconductor substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2017·Application pending·0 cites
- 2844US11223117B2Electronic package and electronic device having the electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Jan 11, 2022·0 cites·17 claims
- 2943US10840581B2Electronic packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2018·Granted Nov 17, 2020·0 cites·12 claims
- 3041US9148113B2Balanced-to-unbalanced converterSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2012·Granted Sep 29, 2015·0 cites·6 claims
- 3141US2014184261A1Testing apparatus and testing methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 3239US9503043B2Duplexer, circuit structure thereof and RF transceiver apparatus comprising the duplexerSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Nov 22, 2016·0 cites·29 claims
- 3337US2015188510A1Circuit structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →