Inventor · disambiguated record

Chin-Wen Lai

Also filed as: LAI CHIN-WEN

1 granted patent·4 pending applications·36 citations·filing 2001–2024

48Inventor score

Technology areasH10W

Files withSILICONWARE PRECISION INDUSTRIES CO LTD5

Top patents by PatentIndex Score

5 records

0178US6617680B2Chip carrier, semiconductor package and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Sep 9, 2003·36 cites·14 claims
0260US2025183109A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
0356US2025174582A1Electronic package and manufacturing method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
0455US2025349678A1Lead frame and manufacturing method of electronic package using the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
0536US2004072389A1Chip carrier, semiconductor package and fabricating method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →