Inventor · disambiguated record
Chih-Ming Lai
Also filed as: LAI CHIH M · LAI CHIH-MING
394 granted patents·109 pending applications·2,384 citations·filing 2002–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD142FOXSEMICON INTEGRATED TECH INC136LAI CHIH-MING58GIGA BYTE TECH CO LTD47IND TECH RES INST38
Top patents by PatentIndex Score
503 records- 0199US9153478B2Spacer etching process for integrated circuit designTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 6, 2015·118 cites·20 claims
- 0298US11862623B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 2, 2024·3 cites·20 claims
- 0398US11342193B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·4 cites·20 claims
- 0496US9793211B2Dual power structure with connection pinsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·13 cites·20 claims
- 0596US9679994B1High fin cut fabrication processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 13, 2017·18 cites·20 claims
- 0696US8226273B2LED lampLAI CHIH-MING·Filed 2010·Granted Jul 24, 2012·26 cites·13 claims
- 0796US7575966B2Method for fabricating pixel structure of active matrix organic light-emitting diodeIND TECH RES INST·Filed 2008·Granted Aug 18, 2009·85 cites·8 claims
- 0895US11688730B2Method and system of manufacturing conductors and semiconductor device which includes conductorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·2 cites·20 claims
- 0995US11092899B2Method for mask data synthesis with wafer target adjustmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·7 cites·20 claims
- 1095US10878162B2Metal with buried power for increased IC device densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·13 cites·20 claims
- 1195US10790155B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 29, 2020·7 cites·20 claims
- 1295USD627507SLamp housingFOXSEMICON INTEGRATED TECH INC·Filed 2010·Granted Nov 16, 2010·71 cites·1 claims
- 1394US11004855B2Buried metal track and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·7 cites·20 claims
- 1494US10497565B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·7 cites·20 claims
- 1594US10177133B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 8, 2019·8 cites·20 claims
- 1694US8962464B1Self-alignment for using two or more layers and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 24, 2015·16 cites·20 claims
- 1794US8344602B2Light emitting diode and light source module incorporating the sameFOXSEMICON INTEGRATED TECH INC·Filed 2010·Granted Jan 1, 2013·21 cites·10 claims
- 1894US8327301B2Routing method for double patterning designCHENG YI-KAN·Filed 2009·Granted Dec 4, 2012·22 cites·28 claims
- 1994US8220956B2LED lampLAI CHIH-MING·Filed 2010·Granted Jul 17, 2012·23 cites·20 claims
- 2094US7762692B2Surface mount light emitting diode assembly and backlight module using the sameFOXSEMICON INTEGRATED TECH INC·Filed 2008·Granted Jul 27, 2010·35 cites·17 claims
- 2194US7024767B1Method for making terminalGIGA BYTE TECH CO LTD·Filed 2005·Granted Apr 11, 2006·10 cites·2 claims
- 2293US11581300B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 14, 2023·2 cites·20 claims
- 2393US10446555B2Buried metal track and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 15, 2019·7 cites·20 claims
- 2493US9911697B2Power strap structure for high performance and low current densityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 6, 2018·8 cites·20 claims
- 2593US9478636B2Method of forming semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Oct 25, 2016·16 cites·20 claims
- 2693US8371717B2LED light emitting device having temperature sensor for controlling current supplied to LEDs therofFOXSEMICON INTEGRATED TECH INC·Filed 2010·Granted Feb 12, 2013·24 cites·8 claims
- 2793US7427772B2Semiconductor light emitting device substrate and method of fabricating the sameIND TECH RES INST·Filed 2006·Granted Sep 23, 2008·27 cites·13 claims
- 2892US10366200B2System for and method of manufacturing a layout design of an integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 30, 2019·8 cites·20 claims
- 2992US7766505B2Light source assemblyFOXSEMICON INTEGRATED TECH INC·Filed 2008·Granted Aug 3, 2010·51 cites·18 claims
- 3092US7558301B2Multiwavelength semiconductor laser array and method of fabricating the sameIND TECH RES INST·Filed 2007·Granted Jul 7, 2009·34 cites·13 claims
- 3192US7242030B2Quantum dot/quantum well light emitting diodeIND TECH RES INST·Filed 2005·Granted Jul 10, 2007·36 cites·44 claims
- 3291US10734321B2Integrated circuit and method of manufacturing sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 4, 2020·6 cites·20 claims
- 3391US10274829B2Multiple patterning decomposition and manufacturing methods for ICTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·5 cites·20 claims
- 3491US10003153B1Connector moduleGIGA BYTE TECH CO LTD·Filed 2017·Granted Jun 19, 2018·8 cites·8 claims
- 3591US7685558B2Method for detection and scoring of hot spots in a design layoutTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Mar 23, 2010·28 cites·16 claims
- 3690US11322362B2Landing metal etch process for improved overlay controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 3, 2022·4 cites·20 claims
- 3790US11004729B2Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·4 cites·20 claims
- 3890US10388644B2Method of manufacturing conductors and semiconductor device which includes conductorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 20, 2019·4 cites·20 claims
- 3990US9852908B2Methods for integrated circuit design and fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·4 cites·20 claims
- 4090US9837751B2Connector cover and connector assemblyGIGA BYTE TECH CO LTD·Filed 2015·Granted Dec 5, 2017·10 cites·10 claims
- 4190US9711890B1Connector cover, connector and connector moduleGIGA BYTE TECH CO LTD·Filed 2016·Granted Jul 18, 2017·10 cites·10 claims
- 4290US9666971B1Connector cover and connector moduleGIGA BYTE TECH CO LTD·Filed 2016·Granted May 30, 2017·10 cites·20 claims
- 4390US9023695B2Method of patterning features of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 5, 2015·11 cites·15 claims
- 4490US8759186B2Semiconductor device and method for manufacturing the sameYEH YUNG-HUI·Filed 2012·Granted Jun 24, 2014·12 cites·19 claims
- 4590US7954072B2Model import for electronic design automationTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted May 31, 2011·20 cites·20 claims
- 4689US10763365B2Metal rail conductors for non-planar semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·3 cites·20 claims
- 4789US10707601B1Memory socket protecting cover and memory socket assemblyGIGA BYTE TECH CO LTD·Filed 2019·Granted Jul 7, 2020·8 cites·11 claims
- 4889US9917050B2Semiconductor device including source/drain contact having height below gate stackTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 13, 2018·6 cites·20 claims
- 4989US9570823B2PCI-E connector cover and PCI-E connector moduleGIGA BYTE TECH CO LTD·Filed 2015·Granted Feb 14, 2017·10 cites·18 claims
- 5089US9449880B1Fin patterning methods for increased process marginTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 20, 2016·6 cites·20 claims
Showing the top 50 of 503 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →