Inventor · disambiguated record
Chih-Hsin Lai
Also filed as: LAI CHIH-HSIN
2 granted patents·1 pending application·6 citations·filing 2008–2022
47Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0173US8618641B2Leadframe-based semiconductor packageCHAN CHANG-YUEH·Filed 2008·Granted Dec 31, 2013·6 cites·28 claims
- 0250US2024120288A1Electronic device and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 0349US9130064B2Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrierSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Sep 8, 2015·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →