Inventor · disambiguated record
Cheng-Yuan Lai
Also filed as: LAI CHENG-YUAN
6 granted patents·1 pending application·622 citations·filing 1999–2013
89Inventor score
Files withSILICONWARE PRECISION INDUSTRIES CO LTD4SILICONWARE PRECISION IND CO L1SIPIX TECHNOLOGY INC1
Top patents by PatentIndex Score
7 records- 0194US9223164B2DisplaySIPIX TECHNOLOGY INC·Filed 2013·Granted Dec 29, 2015·40 cites·11 claims
- 0294US6472741B1Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 29, 2002·230 cites·18 claims
- 0391US6716676B2Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Apr 6, 2004·91 cites·9 claims
- 0491US6462405B1Semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Oct 8, 2002·70 cites·20 claims
- 0591US6400014B1Semiconductor package with a heat sinkSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2001·Granted Jun 4, 2002·76 cites·12 claims
- 0687US6114752ASemiconductor package having lead frame with an exposed base padSILICONWARE PRECISION IND CO L·Filed 1999·Granted Sep 5, 2000·115 cites·15 claims
- 0729US2001040300A1Semiconductor package with heat dissipation openingFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →