Inventor · disambiguated record
Cheng-Jen Lai
Also filed as: LAI CHENG-JEN
2 granted patents·0 citations·filing 2018–2019
23Inventor score
Files withWINBOND ELECTRONICS CORP2
Top patents by PatentIndex Score
2 records- 0147US10680173B2Resistive memory, manufacturing method thereof and chemical mechanical polishing processWINBOND ELECTRONICS CORP·Filed 2018·Granted Jun 9, 2020·0 cites·13 claims
- 0240US10847525B2Method for manufacturing non-volatile memory deviceWINBOND ELECTRONICS CORP·Filed 2019·Granted Nov 24, 2020·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →