Inventor · disambiguated record
Chihting Lai
Also filed as: LAI CHIHTING
0 granted patents·8 pending applications·0 citations·filing 2024–2025
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8
Top patents by PatentIndex Score
8 records- 0181US2025349540A1Metallization structure for coupling boiling enhanced layer to substrate in a cooling systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0277US2025357261A1Package structure with molding layer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0375US2025226216A1Metallization structure for coupling boiling enhanced layer to substrate in a cooling systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0475US2025349814A1Integrated circuit packages with thermal reservoir dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0570US2025210608A1Integrated circuit packages with thermal reservoir dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0670US2025323120A1Semiconductor package with localized hot spot cooling solution and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0770US2025210451A1Package structure with molding layer and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0868US2025233046A1Semiconductor package with localized hot spot cooling solution and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chihting Lai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →