Inventor · disambiguated record
Chen-Chung Lai
Also filed as: LAI CHEN-CHUNG
19 granted patents·2 pending applications·32 citations·filing 2013–2024
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD21
Top patents by PatentIndex Score
21 records- 0190US9412866B2BEOL selectivity stress filmTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 9, 2016·13 cites·20 claims
- 0290US9349688B2Systems and methods to enhance passivation integrityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 24, 2016·5 cites·20 claims
- 0390US9076804B2Systems and methods to enhance passivation integrityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 7, 2015·7 cites·20 claims
- 0481US9070687B2Semiconductor device with self-protecting fuseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 30, 2015·4 cites·20 claims
- 0570US9761486B2Method of chip packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Sep 12, 2017·3 cites·20 claims
- 0666US10777480B2Systems and methods to enhance passivation integrityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 15, 2020·0 cites·20 claims
- 0764US10515866B2Systems and methods to enhance passivation integrityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·0 cites·20 claims
- 0861US2025379158A1Guard ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0959US10157810B2Systems and methods to enhance passivation integrityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·0 cites·20 claims
- 1058US9773716B2Systems and methods to enhance passivation integrityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 26, 2017·0 cites·20 claims
- 1157US10204843B2Interconnect arrangement with stress-reducing structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 12, 2019·0 cites·20 claims
- 1256US2025029870A1Interconnection structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1355US10014251B2Semiconductor device with self-protecting fuse and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 3, 2018·0 cites·20 claims
- 1455US9818666B2Interconnect arrangement with stress-reducing structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·0 cites·20 claims
- 1555US9252047B2Interconnect arrangement with stress-reducing structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 2, 2016·0 cites·20 claims
- 1653US9472508B2Interconnect arrangement with stress-reducing structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 18, 2016·0 cites·20 claims
- 1752US9299658B2Semiconductor device with self-protecting fuse and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 29, 2016·0 cites·20 claims
- 1851US9093373B2Conductive diffusion barrier structure for ohmic contactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 28, 2015·0 cites·20 claims
- 1947US9299621B2Smart measurement techniques to enhance inline process control stabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 29, 2016·0 cites·20 claims
- 2047US9093528B2Stress compensation layer to improve device uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 28, 2015·0 cites·20 claims
- 2146US9406559B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 2, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →