Inventor · disambiguated record
Chipta Priya Laksana
Also filed as: LAKSANA CHIPTA PRIYA
1 granted patent·2 pending applications·0 citations·filing 2022–2025
13Inventor score
Technology areasH10W
Files withTAIWAN SEMICONDUCTOR MFG CO LTD3
Top patents by PatentIndex Score
3 records- 0176US2025357233A1Molding structures for integrated circuit packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0262US12512432B2Dicing process in packages comprising organic interposersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·20 claims
- 0362US2023402339A1Molding Structures for Integrated Circuit Packages and Methods of Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →