Inventor · disambiguated record

Chee Ming Lam

Also filed as: LAM CHEE MING

3 granted patents·1 pending application·1 citations·filing 2019–2024

50Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG4

Top patents by PatentIndex Score

4 records

0181US11908771B2Power semiconductor device with dual heat dissipation structuresINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 20, 2024·1 cites·23 claims
0271US12334414B2Power semiconductor device with dual heat dissipation structuresINFINEON TECHNOLOGIES AG·Filed 2024·Granted Jun 17, 2025·0 cites·24 claims
0341US2022115245A1Power semiconductor package and method for fabricating a power semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2021·Application pending·0 cites
0437US11362023B2Package lead design with grooves for improved dambar separationINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 14, 2022·0 cites·17 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →