Inventor · disambiguated record
Chun Sean Lau
Also filed as: LAU CHUN SEAN
7 granted patents·3 pending applications·0 citations·filing 2017–2024
69Inventor score
Top patents by PatentIndex Score
10 records- 0161US11264301B2System and method to enhance reliability in connection with arrangements including circuitsWESTERN DIGITAL TECH INC·Filed 2020·Granted Mar 1, 2022·0 cites·17 claims
- 0258US11094604B2System and method to enhance solder joint reliabilityWESTERN DIGITAL TECH INC·Filed 2019·Granted Aug 17, 2021·0 cites·20 claims
- 0353US12324102B2Semiconductor storage device including staggered semiconductor memory devices on opposed surfacesWESTERN DIGITAL TECH INC·Filed 2023·Granted Jun 3, 2025·0 cites·19 claims
- 0451US12016111B2Protective enclosure for an electronic deviceWESTERN DIGITAL TECH INC·Filed 2022·Granted Jun 18, 2024·0 cites·20 claims
- 0551US11551991B2Semiconductor device package having cover portion with curved surface profileWESTERN DIGITAL TECH INC·Filed 2020·Granted Jan 10, 2023·0 cites·6 claims
- 0651US10636722B2System and method to enhance solder joint reliabilityWESTERN DIGITAL TECH INC·Filed 2017·Granted Apr 28, 2020·0 cites·18 claims
- 0750US2025379112A1Semiconductor device including a thermal relief layerSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0847US2025307522A1Artificial intelligence system for assessing a printed circuit board designSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0945US2024260237A1Semiconductor storage device including pcb edge heat dissipationWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 1033US11284502B2Thermal relief for through-hole and surface mountingWESTERN DIGITAL TECH INC·Filed 2020·Granted Mar 22, 2022·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →