Inventor · disambiguated record
Chung Woo Lee
Also filed as: LEE CHUNG · LEE CHUNG W · LEE CHUNG-WOO
67 granted patents·13 pending applications·724 citations·filing 1994–2024
99Inventor score
Files withTOYOTA MOTOR CO LTD21SEMES CO LTD14LEE CHUNG WOO11SAMSUNG ELECTRONICS CO LTD11SPERLING MATTHEW NIVEN9
Top patents by PatentIndex Score
80 records- 0194US12207362B2Support unit, substrate treating apparatus including the same and temperature control methodSEMES CO LTD·Filed 2021·Granted Jan 21, 2025·3 cites·16 claims
- 0294USD1007383SFront bumper for a motor vehicleTOYOTA MOTOR CO LTD·Filed 2021·Granted Dec 12, 2023·15 cites·1 claims
- 0394USD713305SFront bumper for an automobileSPERLING MATTHEW NIVEN·Filed 2013·Granted Sep 16, 2014·77 cites·1 claims
- 0492USD760121SMotor vehicle and/or toy replica thereofSATO JINICHI·Filed 2015·Granted Jun 28, 2016·36 cites·1 claims
- 0591USD735082SMotor vehicle and/or toy replica thereofSPERLING MATTHEW NIVEN·Filed 2014·Granted Jul 28, 2015·39 cites·1 claims
- 0690USD723428SMotor vehicle and/or toy replica thereofSPERLING MATTHEW NIVEN·Filed 2013·Granted Mar 3, 2015·35 cites·1 claims
- 0790US7453159B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 18, 2008·14 cites·24 claims
- 0889USD759545SMotor vehicle and/or toy replica thereofSATO JINICHI·Filed 2015·Granted Jun 21, 2016·27 cites·1 claims
- 0988US12176234B2Assembly and method for transferring substrateSEMES CO LTD·Filed 2022·Granted Dec 24, 2024·2 cites·20 claims
- 1088USD1011244SFront bumper for a motor vehicleTOYOTA MOTOR CO LTD·Filed 2023·Granted Jan 16, 2024·7 cites·1 claims
- 1188USD755679SMotor vehicle and/or toy replica thereofSATO JINICHI·Filed 2014·Granted May 10, 2016·29 cites·1 claims
- 1286US7576440B2Semiconductor chip having bond pads and multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 18, 2009·9 cites·20 claims
- 1384USD1000329SRear bumper for a motor vehicleTOYOTA MOTOR CO LTD·Filed 2021·Granted Oct 3, 2023·10 cites·1 claims
- 1483USD1012794SFront bumper for a motor vehicleTOYOTA MOTOR CO LTD·Filed 2023·Granted Jan 30, 2024·5 cites·1 claims
- 1583USD856554SRear combination lamp for an automobileLEE CHUNG WOO·Filed 2018·Granted Aug 13, 2019·22 cites·1 claims
- 1683USD637110SAutomobile and/or toy replica thereofTOYOTA MOTOR CO LTD·Filed 2010·Granted May 3, 2011·27 cites·1 claims
- 1782USD842775SFront bumper for an automobileLEE CHUNG WOO·Filed 2018·Granted Mar 12, 2019·22 cites·1 claims
- 1882USD842176SFront bumper for an automobileLEE CHUNG WOO·Filed 2018·Granted Mar 5, 2019·20 cites·1 claims
- 1979USD1011977SFront bumper for a motor vehicleTOYOTA MOTOR CO LTD·Filed 2023·Granted Jan 23, 2024·4 cites·1 claims
- 2079USD1006682SMotor vehicle and/or toy replica thereofTOYOTA MOTOR CO LTD·Filed 2021·Granted Dec 5, 2023·6 cites·1 claims
- 2179US7541682B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 2, 2009·5 cites·14 claims
- 2278USD713306SRear bumper for an automobileSPERLING MATTHEW NIVEN·Filed 2013·Granted Sep 16, 2014·23 cites·1 claims
- 2377USD1047762SMotor vehicle and/or toy vehicle replicaTOYOTA MOTOR CO LTD·Filed 2022·Granted Oct 22, 2024·6 cites·1 claims
- 2477USD630975SFront grill for an automobileTOYOTA MOTOR CO LTD·Filed 2010·Granted Jan 18, 2011·24 cites·1 claims
- 2576US9837822B2Control device of energy storage systemLSIS CO LTD·Filed 2015·Granted Dec 5, 2017·3 cites·9 claims
- 2676USD672482SCombination lamp for an automobileLEE CHUNG·Filed 2011·Granted Dec 11, 2012·22 cites·1 claims
- 2776US7547977B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 16, 2009·4 cites·14 claims
- 2876US6642627B2Semiconductor chip having bond pads and multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 4, 2003·14 cites·28 claims
- 2975USD1007388SSide mirror for a motor vehicleTOYOTA MOTOR CO LTD·Filed 2021·Granted Dec 12, 2023·5 cites·1 claims
- 3075USD840875SMotor vehicle and/or toy replica thereofLEE CHUNG WOO·Filed 2018·Granted Feb 19, 2019·15 cites·1 claims
- 3174USD735081SMotor vehicle and/or toy replica thereofSPERLING MATTHEW NIVEN·Filed 2014·Granted Jul 28, 2015·14 cites·1 claims
- 3274USD583727SFront bumper for an automobileTOYOTA MOTOR CO LTD·Filed 2008·Granted Dec 30, 2008·20 cites·1 claims
- 3370US8994328B2Electric vehicle, electric-vehicle charging stand and communication system therebetweenLEE CHUNG WOO·Filed 2011·Granted Mar 31, 2015·3 cites·8 claims
- 3469USD679633SMotor vehicle and/or toy replica thereofSONODA TATSUYA·Filed 2011·Granted Apr 9, 2013·17 cites·1 claims
- 3568USD585341SFront portion of a motor vehicle and/or toy replica thereofTOYOTA MOTOR CO LTD·Filed 2008·Granted Jan 27, 2009·16 cites·1 claims
- 3667USD583722SFront grille for an automobileTOYOTA MOTOR CO LTD·Filed 2008·Granted Dec 30, 2008·15 cites·1 claims
- 3765USD716195SFront grill for an automobileSPERLING MATTHEW NIVEN·Filed 2013·Granted Oct 28, 2014·13 cites·1 claims
- 3863US2025218736A1Apparatus and method for controlling temperatureSEMES CO LTD·Filed 2024·Application pending·0 cites
- 3961US6037662AChip scale packageSAMSUNG ELECTRONICS CO LTD·Filed 1998·Granted Mar 14, 2000·28 cites·29 claims
- 4060US12300531B2Support unit, heating unit and substrate treating apparatus including the sameSEMES CO LTD·Filed 2022·Granted May 13, 2025·0 cites·19 claims
- 4160US2024222099A1Control method for support unit, substrate treating method and substrate treating apparatusSEMES CO LTD·Filed 2023·Application pending·0 cites
- 4259USD716196SFront grill for an automobileSPERLING MATTHEW NIVEN·Filed 2013·Granted Oct 28, 2014·10 cites·1 claims
- 4358US11543838B2Air pressure control deviceSEMES CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·12 claims
- 4457US2024210959A1Substrate treating apparatus and substrate treating methodSEMES CO LTD·Filed 2023·Application pending·0 cites
- 4556US12411003B2Apparatus for wafer placement teaching and method for wafer placement teaching using the sameSEMES CO LTD·Filed 2022·Granted Sep 9, 2025·0 cites·20 claims
- 4655US12313392B2Apparatus and method for measuring the gapSEMES CO LTD·Filed 2021·Granted May 27, 2025·0 cites·19 claims
- 4754USD718674SFront portion of a motor vehicleSPERLING MATTHEW NIVEN·Filed 2013·Granted Dec 2, 2014·8 cites·1 claims
- 4852US7825523B2Semiconductor chip having bond padsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 2, 2010·0 cites·24 claims
- 4952US2023060901A1Supporting unit and apparatus for treating substrateSEMES CO LTD·Filed 2022·Application pending·0 cites
- 5049US7148578B2Semiconductor multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 12, 2006·2 cites·28 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →