Inventor · disambiguated record
Ching-Kuan Lee
Also filed as: LEE CHING-KUAN
2 granted patents·3 pending applications·6 citations·filing 2003–2023
48Inventor score
Top patents by PatentIndex Score
5 records- 0182US12027470B2Package carrier having a stiffener between solder bumpsIND TECH RES INST·Filed 2021·Granted Jul 2, 2024·1 cites·20 claims
- 0276US9941226B2Integrated millimeter-wave chip packageIND TECH RES INST·Filed 2014·Granted Apr 10, 2018·5 cites·15 claims
- 0346US2024170473A1Chip package structure and manufacturing method thereofIND TECH RES INST·Filed 2023·Application pending·0 cites
- 0440US2007131902A1Polymer dispersed liquid crystal emulsion and polymer dispersed liquid crystal composite filmIND TECH RES INST·Filed 2006·Application pending·0 cites
- 0532US2003218967A1Abrasion-resistant compact discDAXON TECHNOLOGY INC·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →