Inventor · disambiguated record
Chanmi Lee
Also filed as: LEE CHANMI
10 granted patents·10 pending applications·14 citations·filing 2017–2025
82Inventor score
Top patents by PatentIndex Score
20 records- 0187US9997521B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 12, 2018·5 cites·15 claims
- 0286US10573651B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 25, 2020·4 cites·20 claims
- 0382US10396083B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Aug 27, 2019·3 cites·19 claims
- 0473US2025154325A1Vanillic acid-based organic-inorganic compound, curable composition, and production method thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2024·Application pending·0 cites
- 0572US10153283B2Semiconductor devices including conductive contacts and insulation patterns arranged in an alternating sequence and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 11, 2018·2 cites·10 claims
- 0671US2023391956A1Silyl ether isohexide-based organic-inorganic compound, method for preparing the same, and curable composition containing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 0769US11618109B2Wire for electric bondingELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Apr 4, 2023·0 cites·13 claims
- 0863US2022402070A1Laser control structure and laser bonding method using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Application pending·0 cites
- 0961US12457833B2Electronic device and its repair methodELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 1060US12349505B2Method of manufacturing electric deviceELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 1156US12206056B2Semiconductor package with intermetallic-compound solder-joint comprising solder, UBM, and reducing layer materialsELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 1256US2024297051A1Method for manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1356US2024021570A1Bonding apparatusELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 1455US2023326810A1Microwave heating device and method for manufacturing semiconductor packaging using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Application pending·0 cites
- 1553US2023217649A1Method of fabricating semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 1652US11677060B2Method for transferring and bonding of devicesELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Jun 13, 2023·0 cites·12 claims
- 1752US2023276611A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1850US2025282908A1Flux agent and semiconductor package including cured product thereofELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2025·Application pending·0 cites
- 1949US2022077099A1Composition for conductive adhesive, semiconductor package comprising cured product thereof, and method of manufacturing semiconductor package using the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Application pending·0 cites
- 2047US12446220B2Semiconductor memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Chanmi Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →