Inventor · disambiguated record
Chang-Chi Lee
Also filed as: LEE CHANG-CHI · VICTOR JAY
42 granted patents·26 pending applications·572 citations·filing 1998–2025
97Inventor score
Files withADVANCED SEMICONDUCTOR ENG36LEE CHANG CHI8RICH ELECTRIC WIRE AND CABLE CO LTD7TAI SHINY TECH CO LTD2ASIA VITAL COMPONENTS CO LTD1
Top patents by PatentIndex Score
68 records- 0196US6528882B2Thermal enhanced ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Mar 4, 2003·151 cites·18 claims
- 0295US11127650B2Semiconductor device package including thermal dissipation element and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Sep 21, 2021·8 cites·19 claims
- 0395US10134677B1Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 20, 2018·20 cites·18 claims
- 0494US8035213B2Chip package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Oct 11, 2011·124 cites·20 claims
- 0593US8870601B2USB connector moduleRICH ELECTRIC WIRE AND CABLE CO LTD·Filed 2013·Granted Oct 28, 2014·33 cites·9 claims
- 0692USD415469SConnector for a microphoneLEE CHANG-CHI·Filed 1998·Granted Oct 19, 1999·54 cites·1 claims
- 0791US11594518B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Feb 28, 2023·2 cites·17 claims
- 0889US10037974B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jul 31, 2018·10 cites·19 claims
- 0987US8698307B2Semiconductor package with integrated metal pillars and manufacturing methods thereofSHIH MENG-KAI·Filed 2011·Granted Apr 15, 2014·16 cites·20 claims
- 1087US7598546B1Separative extended gate field effect transistor based vitamin C sensor and forming method thereofUNIV NAT YUNLIN SCI & TECH·Filed 2008·Granted Oct 6, 2009·15 cites·27 claims
- 1187US7110258B2Heat dissipating microdeviceASIA VITAL COMPONENTS CO LTD·Filed 2003·Granted Sep 19, 2006·47 cites·19 claims
- 1280US9589840B2Semiconductor package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Mar 7, 2017·4 cites·18 claims
- 1377US2025022848A1Semiconductor package including processing element and i/o elementADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1476US12107074B2Semiconductor package including processing element and I/O elementADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Oct 1, 2024·0 cites·16 claims
- 1575US9917043B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 13, 2018·2 cites·17 claims
- 1675US2025054877A1Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1774US7091420B2Audio cable structureVICTOR JAY·Filed 2005·Granted Aug 15, 2006·4 cites·6 claims
- 1873US8022534B2Semiconductor package using an active type heat-spreading elementADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Sep 20, 2011·6 cites·19 claims
- 1972US9426910B1Transmission cable for electrical devicesRICH ELECTRIC WIRE AND CABLE CO LTD·Filed 2015·Granted Aug 23, 2016·2 cites·6 claims
- 2072US6403896B1Substrate having specific pad distributionADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jun 11, 2002·19 cites·10 claims
- 2171US12213247B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 2270US11426508B2Snivel suction apparatusTAI SHINY TECH CO LTD·Filed 2019·Granted Aug 30, 2022·2 cites·10 claims
- 2370US8333876B2Ion concentration measurement system and methods thereofCHOU JUNG-CHUAN·Filed 2009·Granted Dec 18, 2012·2 cites·22 claims
- 2469US12132006B2Semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 29, 2024·0 cites·17 claims
- 2569US8790125B1Signal connector moduleRICH ELECTRIC WIRE AND CABLE CO LTD·Filed 2013·Granted Jul 29, 2014·6 cites·8 claims
- 2665US6969805B2Structure of audio signal cableLEE CHANG-CHI·Filed 2003·Granted Nov 29, 2005·6 cites·5 claims
- 2764US12156336B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Nov 26, 2024·0 cites·20 claims
- 2864US2025393121A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 2962US8136518B2Sun-tracking solar energy collector apparatusLEE CHANG CHI·Filed 2009·Granted Mar 20, 2012·0 cites·10 claims
- 3060US12406921B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Sep 2, 2025·0 cites·19 claims
- 3160US7288717B1Electrical box assembly for a solar energy moduleJIN HSIN HO MOLD ENTPR CO LTD·Filed 2007·Granted Oct 30, 2007·7 cites·1 claims
- 3260US2025105570A1Cable connectorTAIWAN MASTER HILL TECH CO LTD·Filed 2024·Application pending·0 cites
- 3359USD742827SCase of connector adapterRICH ELECTRIC WIRE AND CABLE CO LTD·Filed 2014·Granted Nov 10, 2015·10 cites·1 claims
- 3459US6476318B1Signal cable connectorRICH ELECTRIC WIRE & CABLE CO·Filed 2001·Granted Nov 5, 2002·15 cites·1 claims
- 3559US2010293729A1Cleaning apparatus for solar panelsLEE CHANG CHI·Filed 2009·Application pending·0 cites
- 3658US12381150B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Aug 5, 2025·0 cites·14 claims
- 3758US12347811B2Electronic device including electronic component receiving power from two sidesADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 1, 2025·0 cites·18 claims
- 3857US12176305B2Semiconductor package with integrated voltage regulator device and separate bridge dieADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 24, 2024·0 cites·7 claims
- 3957US11967559B2Electronic packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 23, 2024·0 cites·7 claims
- 4057US2024189497A1Nasal suction device with modified handleTAI SHINY TECH CO LTD·Filed 2023·Application pending·0 cites
- 4155US11991827B2Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted May 21, 2024·0 cites·17 claims
- 4253US10541198B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Jan 21, 2020·0 cites·18 claims
- 4353US2024128193A1Electronic module and electronic apparatusADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 4452US10056325B2Semiconductor package having a trench penetrating a main bodyADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Aug 21, 2018·0 cites·18 claims
- 4552US2025029970A1Electronic device and chiplet moduleADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 4652US2004138960A1Online entrusting systemFiled 2003·Application pending·0 cites
- 4751US2024055365A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 4851US2008222988A1Integrated fixing frame for a solar energy moduleLEE CHANG CHI·Filed 2007·Application pending·0 cites
- 4951US2025038084A1Electronic deviceADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 5050US2008223432A1Fixing frame for a solar energy moduleLEE CHANG CHI·Filed 2007·Application pending·0 cites
Showing the top 50 of 68 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →