Inventor · disambiguated record
Choong-Hyun Lee
Also filed as: LEE CHOONG HYUN
11 granted patents·5 pending applications·23 citations·filing 2005–2024
85Inventor score
Files withJAPAN SCIENCE & TECH AGENCY4PARK NO-CHUN2SAMSUNG ELECTRONICS CO LTD2WONIK IPS CO LTD2LEE CHOONG-HYUN1
Top patents by PatentIndex Score
16 records- 0186US11804371B2Substrate treatment apparatus and method of performing treatment process on substrateSEMES CO LTD·Filed 2020·Granted Oct 31, 2023·2 cites·19 claims
- 0283US9722026B2Semiconductor structure in which film including germanium oxide is provided on germanium layer, and method for manufacturing semiconductor structureJAPAN SCIENCE & TECH AGENCY·Filed 2014·Granted Aug 1, 2017·8 cites·13 claims
- 0374US8354604B2Auto transfer switch including coverVITZROTECH CO LTD·Filed 2010·Granted Jan 15, 2013·5 cites·4 claims
- 0473US9691620B2Semiconductor structure having film including germanium oxide on germanium layer and method of fabricating the sameJAPAN SCIENCE & TECH AGENCY·Filed 2013·Granted Jun 27, 2017·3 cites·10 claims
- 0564US10109710B2Semiconductor device having germanium layer as channel region and method for manufacturing the sameJAPAN SCIENCE & TECH AGENCY·Filed 2015·Granted Oct 23, 2018·1 cites·12 claims
- 0661US2024357799A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0758US8519285B2One body-type power transfer switchPARK NO-CHUN·Filed 2010·Granted Aug 27, 2013·2 cites·1 claims
- 0854US8604377B2Automatic transfer switchLEE CHOONG-HYUN·Filed 2011·Granted Dec 10, 2013·1 cites·3 claims
- 0954US8471163B2Auto transfer switch including terminal coverPARK NO-CHUN·Filed 2010·Granted Jun 25, 2013·1 cites·1 claims
- 1052US9647074B2Semiconductor-substrate manufacturing method and semiconductor-device manufacturing method in which germanium layer is heat-treatedJAPAN SCIENCE & TECH AGENCY·Filed 2014·Granted May 9, 2017·0 cites·6 claims
- 1146US2024052488A1Feeding block and substrate processing apparatus including the sameWONIK IPS CO LTD·Filed 2023·Application pending·0 cites
- 1245US2024303476A1Neural network system and method of implementing samePEBBLE SQUARE INC·Filed 2024·Application pending·0 cites
- 1341US2018016194A1Method for producing carbide derived carbon layer with dimple pattern and carbide derived carbon layer with dimple pattern produced by the methodUNIV KOREA RES & BUS FOUND·Filed 2017·Application pending·0 cites
- 1440US12249536B2Substrate supporting assembly and substrate processing apparatusWONIK IPS CO LTD·Filed 2021·Granted Mar 11, 2025·0 cites·9 claims
- 1540US7642269B2Pyrrolo[3,2-B]pyridine derivatives and processes for the preparation thereofYUHAN CORP·Filed 2005·Granted Jan 5, 2010·0 cites·5 claims
- 1638US2016081620A1Method and apparatus for health careSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →