Inventor · disambiguated record
Choon Keun Lee
Also filed as: LEE CHOON K · LEE CHOON KEUN
15 granted patents·29 pending applications·33 citations·filing 2006–2023
88Inventor score
Top patents by PatentIndex Score
44 records- 0189US7653990B2Manufacturing method of printed circuit board using an ink jetSAMSUNG ELECTRO MECH·Filed 2007·Granted Feb 2, 2010·20 cites·14 claims
- 0274US8198542B2Flexible printed circuit board and method of manufacturing the sameLEE KYUNG HO·Filed 2008·Granted Jun 12, 2012·5 cites·6 claims
- 0368US2023365785A1Surface-treated inorganic nanoparticle and composite film including the sameSAMSUNG ELECTRO MECH·Filed 2022·Application pending·0 cites
- 0466US11024556B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Jun 1, 2021·1 cites·18 claims
- 0566US8832929B2Method of manufacturing a flexible printed circuit boardLEE KYUNG HO·Filed 2012·Granted Sep 16, 2014·1 cites·2 claims
- 0664US7644496B2Manufacturing method for imprinting stamperSAMSUNG ELECTRO MECH·Filed 2007·Granted Jan 12, 2010·2 cites·6 claims
- 0762US12163086B2Dispersant and compositionSAMSUNG ELECTRO MECH·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 0861US8779561B2LED backlight unit without printed circuit board and method of manufacturing the sameJEONG GI HO·Filed 2010·Granted Jul 15, 2014·1 cites·5 claims
- 0959US7562447B2Method of manufacturing printed circuit board for fine circuit formationSAMSUNG ELECTRO MECH·Filed 2007·Granted Jul 21, 2009·2 cites·7 claims
- 1057US12242024B2Dyed lens and method of dyeing lensSAMSUNG ELECTRO MECH·Filed 2021·Granted Mar 4, 2025·0 cites·5 claims
- 1156US9202624B2Conductive paste composition for external electrode and multilayer ceramic electronic component fabricated using the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Dec 1, 2015·0 cites·12 claims
- 1254US2024172373A1Printed circuit board and manufacturing method for the sameSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1352US2009183903A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1452US2013284505A1Adhesive member for manufacturing printed circuit board, printed circuit board, and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1550US8187518B2Method for manufacturing substrate by imprintingLEE CHOON-KEUN·Filed 2007·Granted May 29, 2012·1 cites·5 claims
- 1650US2015056472A1Laminate for Printed Circuit Board and Printed Circuit Board Using The SameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1749US2015053458A1Insulating film for printed circuit board and products having the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1849US2013064994A1Apparatus and method for manufacturing substrateSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1948US2007221942A1LED backlight unit without printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2048US2008012168A1Method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2147US2014124434A1FilterSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2247US2014037889A1Insulator for build-up pcb and method of manufacturing pcb using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2346US8309636B2Flame retardant resin composition for multilayer wiring board and multilayer wiring board including the sameJUNG HYUNG MI·Filed 2011·Granted Nov 13, 2012·0 cites·17 claims
- 2445US2022001418A1Lens dyeing method, and lens assembly manufacturing methodSAMSUNG ELECTRO MECH·Filed 2021·Application pending·0 cites
- 2545US2013000965A1Dielectric composition, multilayered printed circuit board comprising dielectric layer manufactured thereof, and method for preparing the multilayered printed circuit boardSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 2645US2008034581A1Method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2745US2014041445A1Apparatus for measuring drying rate and method for measuring drying rate using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2844US8216503B2Method for manufacturing printed circuit board using imprintingCHO JAE-CHOON·Filed 2007·Granted Jul 10, 2012·0 cites·10 claims
- 2944US2008057444A1Method of manufacturing a broad stamperSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 3044US2011200753A1Apparatus and method for manufacturing substrateSHIN DONG JOO·Filed 2010·Application pending·0 cites
- 3143US8840967B2Method for manufacturing printed circuit board including flame retardant insulation layerCHO JAE-CHOON·Filed 2011·Granted Sep 23, 2014·0 cites·13 claims
- 3243US7666292B2Method of manufacturing printed circuit board using imprinting processSAMSUNG ELECTRO MECH·Filed 2006·Granted Feb 23, 2010·0 cites·2 claims
- 3342US2007020397A1Method of fabricating printed circuit board using imprinting processSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3441US2014014402A1Epoxy resin composition for build-up insulating film, insulating film formed therefrom, and multilayer printed circuit board having the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3541US2006222833A1Imprinting mold for printed circuit board having excellent durability and method of manufacturing printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 3641US2014017487A1Insulation film having metal layerSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3740US2012103507A1Photosensitive composite and build-up insulation film with the photosensitive composite, and method for manufacturing circuit board using the build-up insulation filmCHO JAE CHOON·Filed 2011·Application pending·0 cites
- 3839US2012018008A1Apparatus for supplying sourceSHIN DONG JOO·Filed 2010·Application pending·0 cites
- 3938US2012292424A1SlitterSHIN DONG JOO·Filed 2012·Application pending·0 cites
- 4038US2011298786A1Color electronic paper display device and method for manufacturing the sameCHO JAE CHOON·Filed 2010·Application pending·0 cites
- 4134US2012125667A1Printed circuit board and method of manufacturing the sameJUNG HYUNG MI·Filed 2011·Application pending·0 cites
- 4233US2012074430A1Radiating substrate and method for manufacturing the radiating substrate, and luminous element package with the radiating substrateLEE KYU SANG·Filed 2011·Application pending·0 cites
- 4332US2011317382A1Insulating resin composition and printed circuit substrate using the sameCHO JAE CHOON·Filed 2010·Application pending·0 cites
- 4432US2012090172A1Method of manufacturing printed circuit boadPARK MOON SOO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →