Inventor · disambiguated record
Chih-Cheng Lee
Also filed as: LEE CHIH-CHENG
108 granted patents·13 pending applications·273 citations·filing 1997–2025
99Inventor score
Files withADVANCED SEMICONDUCTOR ENG84FUTAIJING PREC ELECTRONICS YANTAI CO LTD15CHI MEI CORP10SUNREX TECHNOLOGY CORP4LEE CHIH-CHENG3
Top patents by PatentIndex Score
121 records- 0197US11776885B2Substrate, semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 3, 2023·4 cites·16 claims
- 0297US9887167B1Embedded component package structure and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 6, 2018·54 cites·21 claims
- 0397US9549468B1Semiconductor substrate, semiconductor module and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jan 17, 2017·36 cites·20 claims
- 0494US11469186B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Oct 11, 2022·3 cites·15 claims
- 0592US12105949B2Touchpad device and operation method of the sameSUNREX TECHNOLOGY CORP·Filed 2023·Granted Oct 1, 2024·2 cites·10 claims
- 0692US11941189B2Touchpad device and operation method of the sameSUNREX TECHNOLOGY CORP·Filed 2023·Granted Mar 26, 2024·2 cites·10 claims
- 0792US11239184B2Package substrate, electronic device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Feb 1, 2022·3 cites·20 claims
- 0892US11233022B2Electrical connection placement of semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 25, 2022·3 cites·16 claims
- 0991US12179672B2Energy absorbing structure for vehicle-mounted display screen and display screen using the sameFUTAIJING PREC ELECTRONICS YANTAI CO LTD·Filed 2022·Granted Dec 31, 2024·3 cites·18 claims
- 1091US9966333B2Semiconductor substrate, semiconductor module and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 8, 2018·6 cites·19 claims
- 1190US9754906B2Double plated conductive pillar package substrateADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Sep 5, 2017·7 cites·20 claims
- 1289USD398540SWatch caseE GLUCK CORP·Filed 1997·Granted Sep 22, 1998·37 cites·1 claims
- 1388US10446515B2Semiconductor substrate and semiconductor packaging device, and method for forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 15, 2019·6 cites·18 claims
- 1487US11018120B2Semiconductor device package with stress buffering layer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 25, 2021·4 cites·17 claims
- 1587US2025105122A1Substrate, semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2024·Application pending·0 cites
- 1685US9420695B2Semiconductor package structure and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 16, 2016·6 cites·17 claims
- 1784US12165963B2Substrate, semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Dec 10, 2024·0 cites·18 claims
- 1884US11865890B2Rocking arm structure providing additional wheel support and device having the sameFUTAIJING PREC ELECTRONICS YANTAI CO LTD·Filed 2022·Granted Jan 9, 2024·2 cites·11 claims
- 1984US10074602B2Substrate, semiconductor package structure and manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Sep 11, 2018·4 cites·23 claims
- 2084US9997442B1Semiconductor device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jun 12, 2018·7 cites·27 claims
- 2184US8674030B2Modified high cis conjugated diene copolymer and manufacturing method of the sameCHI MEI CORP·Filed 2012·Granted Mar 18, 2014·4 cites·16 claims
- 2283US10181438B2Semiconductor substrate mitigating bridgingADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Jan 15, 2019·4 cites·26 claims
- 2383US9812387B2Semiconductor substrate, semiconductor module and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Nov 7, 2017·3 cites·24 claims
- 2482US12304786B2Lifting assembly having gear structure and lifting device having the sameFUTAIJING PREC ELECTRONICS YANTAI CO LTD·Filed 2022·Granted May 20, 2025·1 cites·12 claims
- 2582US10017635B2Thermoplastic resin composition and product formed therefromCHI MEI CORP·Filed 2016·Granted Jul 10, 2018·1 cites·17 claims
- 2682US2025273638A1Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 2781US11600901B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 7, 2023·2 cites·5 claims
- 2880US12451415B2Semiconductor device package, electronic assembly and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Oct 21, 2025·0 cites·13 claims
- 2980US12300677B2Semiconductor device package including stress buffering layerADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted May 13, 2025·0 cites·13 claims
- 3080US9426891B2Circuit board with embedded passive component and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 23, 2016·5 cites·20 claims
- 3180USD397619SWatch caseE GLUCK CORP·Filed 1997·Granted Sep 1, 1998·23 cites·1 claims
- 3279US11062996B2Embedded component package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jul 13, 2021·2 cites·22 claims
- 3378US12224481B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Feb 11, 2025·0 cites·10 claims
- 3478US10334728B2Reduced-dimension via-land structure and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Jun 25, 2019·3 cites·17 claims
- 3578US8895665B2Modified conjugated diene polymer and synthesis method thereofCHI MEI CORP·Filed 2013·Granted Nov 25, 2014·2 cites·15 claims
- 3677US10734704B2Antenna package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Aug 4, 2020·2 cites·21 claims
- 3777US8322032B2Substrate structure and method for manufacturing the sameLEE CHIH-CHENG·Filed 2010·Granted Dec 4, 2012·4 cites·6 claims
- 3876US10636730B2Semiconductor package and semiconductor manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Apr 28, 2020·2 cites·17 claims
- 3976US10128198B2Double side via last method for double embedded patterned substrateADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 13, 2018·2 cites·18 claims
- 4075US10096542B2Substrate, semiconductor package structure and manufacturing processADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Oct 9, 2018·2 cites·21 claims
- 4175US9984898B2Substrate, semiconductor package including the same, and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 29, 2018·2 cites·32 claims
- 4275US9659853B2Double side via last method for double embedded patterned substrateADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted May 23, 2017·2 cites·11 claims
- 4374US2025183517A1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 4473US12408297B2Liquid-cooling system including monitoring and alerting module, monitoring and alerting method for liquid-cooling system, and electronic device including the sameWISTRON CORP·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
- 4573US11942652B2Limiting device and robot using the sameFUTAIJING PREC ELECTRONICS YANTAI CO LTD·Filed 2022·Granted Mar 26, 2024·0 cites·8 claims
- 4672US11276660B2Semiconductor device package having a core substrate and an embedded component in the core substrateADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 15, 2022·1 cites·19 claims
- 4772US10665523B2Semiconductor substrate, semiconductor package, and method for forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted May 26, 2020·1 cites·18 claims
- 4872US9481746B2Modified high-cis isoprene polymer, method for producing the same, and tire containing aforementioned polymerCHI MEI CORP·Filed 2014·Granted Nov 1, 2016·1 cites·12 claims
- 4972US8722810B2Modified high CIS conjugated diene copolymer and preparing method of the sameCHI MEI CORP·Filed 2012·Granted May 13, 2014·2 cites·18 claims
- 5071US12040287B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
Showing the top 50 of 121 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Chih-Cheng Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →