Inventor · disambiguated record
Chang Bo Lee
Also filed as: LEE CHANG-BO
4 granted patents·18 pending applications·6 citations·filing 2011–2018
60Inventor score
Top patents by PatentIndex Score
22 records- 0179US9040838B2Method for forming solder resist and substrate for packageSAMSUNG ELECTRO MECH·Filed 2013·Granted May 26, 2015·6 cites·6 claims
- 0249US10559540B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 11, 2020·0 cites·20 claims
- 0347US9235129B2Composition for photoresist development and method of developing photoresist using the sameSAMSUNG ELECTRO MECH·Filed 2014·Granted Jan 12, 2016·0 cites·16 claims
- 0445US2013026626A1Method for forming bumps and substrate including the bumpsSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 0543US2015053456A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0643US2013089703A1Solder resist composition, board for package comprising solder resist opening using the composition, and method for preparing the board for packageSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 0743US2015373856A1Method for forming bumps and substrate including the bumpsSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 0842US2015250050A1Embedded board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0942US2015156860A1Solder resist opening structure and circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1041US2014183726A1Package substrate, method for manufacturing the same, and package on package substrateSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1140US2014037862A1Method for manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1240US2014041911A1Flat dam and method for manufacturing chip package using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1337US2013175238A1Etching solution and method of manufacturing printed wiring substrate using the sameHONG DAE JO·Filed 2012·Application pending·0 cites
- 1436US2019027419A1Fan-out semiconductor package and package substrate comprising the sameSAMSUNG ELECTRO MECH·Filed 2017·Application pending·0 cites
- 1536US2012266463A1Method for manufacturing printed circuit boardLEE CHANG BO·Filed 2011·Application pending·0 cites
- 1633US2012103662A1Printed circuit board and manufacturing method thereofLEE CHANG BO·Filed 2011·Application pending·0 cites
- 1731US2016174381A1Embedded printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 1830US2016360609A1Circuit substrate and electronic equipment including the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 1930US2012055901A1Substrate fabricating apparatus and substrate fabricating methodLEE CHANG BO·Filed 2011·Application pending·0 cites
- 2029US9107329B2Method for manufacturing printed circuit boardLEE CHANG BO·Filed 2011·Granted Aug 11, 2015·0 cites·15 claims
- 2127US2015198888A1Method for manufacturing substrate for packageSAMSUNG ELECTRO MECH·Filed 2015·Application pending·0 cites
- 2227US2017019989A1Circuit board and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →