Inventor · disambiguated record
Chae Sung Lee
Also filed as: LEE CHAE SUNG
5 granted patents·1 pending application·2 citations·filing 2020–2024
61Inventor score
Files withSK HYNIX INC6
Top patents by PatentIndex Score
6 records- 0183US11222872B2Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2020·Granted Jan 11, 2022·2 cites·20 claims
- 0254US2024234379A1Stack packages and methods of manufacturing the sameSK HYNIX INC·Filed 2024·Application pending·0 cites
- 0352US11804474B2Stack packages and methods of manufacturing the sameSK HYNIX INC·Filed 2021·Granted Oct 31, 2023·0 cites·8 claims
- 0451US11444063B2Semiconductor package including vertical interconnectorSK HYNIX INC·Filed 2021·Granted Sep 13, 2022·0 cites·21 claims
- 0550US11502028B2Semiconductor package including a wire and a method of fabricating the semiconductor packageSK HYNIX INC·Filed 2021·Granted Nov 15, 2022·0 cites·17 claims
- 0647US11784162B2Semiconductor package including vertical interconnectorSK HYNIX INC·Filed 2021·Granted Oct 10, 2023·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →