Inventor · disambiguated record
Chia-Ling Lee
Also filed as: LEE CHIA-LING
4 granted patents·8 pending applications·7 citations·filing 2006–2024
66Inventor score
Files withADVANCED SEMICONDUCTOR ENG2NEXPOWER TECH CORPORATION2PENG MING CHUNG2POWERTECH TECHNOLOGY INC2LEE CHIA-LING1
Top patents by PatentIndex Score
12 records- 0190US11360524B2Electronic devicePENG MING CHUNG·Filed 2021·Granted Jun 14, 2022·3 cites·14 claims
- 0287US10963019B2Electronic device with circuit board and hinge thereinPENG MING CHUNG·Filed 2020·Granted Mar 30, 2021·3 cites·25 claims
- 0356US7511936B2Method and apparatus for dynamic plasma treatment of bipolar ESC systemTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 31, 2009·1 cites·27 claims
- 0456US2024274566A1Package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0555US2025288633A1Sustained-Release Formulation Containing Acetone-Extracted Product of Gamboge ResinTAIWAN SUNPAN BIOTECHNOLOGY DEV CO LTD·Filed 2024·Application pending·0 cites
- 0651US2013333750A1Thin film solar cell and manufacturing method thereofNEXPOWER TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 0748US2013139875A1Thin-film solar cell and method for forming the sameLEE CHIA-LING·Filed 2012·Application pending·0 cites
- 0846US12507495B2Image sensor package with low light-sensing noisePOWERTECH TECHNOLOGY INC·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 0944US2019057920A1Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Application pending·0 cites
- 1037US2016379910A1Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Application pending·0 cites
- 1134US2018062010A1Arc-bending translucent assembly, use and method for manufacturing thereofNEXPOWER TECH CORPORATION·Filed 2017·Application pending·0 cites
- 1228US2018366605A1Solar power sunroof device having low reflectance and manufacturing method thereofNEXPOWER TECH CORPORATION·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →