Inventor · disambiguated record
Chai Chee Lee
Also filed as: LEE CHAI CHEE
1 granted patent·5 pending applications·0 citations·filing 2019–2025
10Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0157US2025140729A1Molded power package with vertical interconnectINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0252US2025391744A1Semiconductor device including a coined diepadINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0351US2024006260A1Encapsulated package with exposed electrically conductive structures and sidewall recessINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0444US11183451B2Interconnect clip with angled contact surface and raised bridgeINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 23, 2021·0 cites·20 claims
- 0536US2025336782A1Vertical gan deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
- 0631US2021074667A1Interconnect Clip with Angled Contact Surface and Raised Bridge Technical FieldINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →