Inventor · disambiguated record
Chia Hsuan Lee
Also filed as: LEE CHIA-HSUAN
8 granted patents·7 citations·filing 2018–2023
79Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD8
Top patents by PatentIndex Score
8 records- 0186US10643892B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 5, 2020·3 cites·20 claims
- 0285US11211289B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·20 claims
- 0384US11482450B2Methods of forming an abrasive slurry and methods for chemical- mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 25, 2022·1 cites·20 claims
- 0483US12068195B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 0577US11710659B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 0674US10937691B2Methods of forming an abrasive slurry and methods for chemical-mechanical polishingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 2, 2021·1 cites·20 claims
- 0767US11532514B2Structure and formation method of semiconductor device with conductive featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·0 cites·20 claims
- 0858US10957587B2Structure and formation method of semiconductor device with conductive featureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →