Inventor · disambiguated record
Chang-Cheol Lee
Also filed as: LEE CHANG-CHEOL
7 granted patents·2 pending applications·357 citations·filing 1999–2012
87Inventor score
Top patents by PatentIndex Score
9 records- 0194US6087722AMulti-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jul 11, 2000·260 cites·11 claims
- 0289US7298032B2Semiconductor multi-chip package and fabrication methodSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 20, 2007·58 cites·3 claims
- 0372US7374966B2Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted May 20, 2008·5 cites·2 claims
- 0471US8941245B2Semiconductor package including semiconductor chip with through openingLEE CHANG-CHEOL·Filed 2012·Granted Jan 27, 2015·4 cites·19 claims
- 0571US7148080B2Method for joining lead frames in a package assembly, method for forming a chip stack package, and a chip stack packageSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Dec 12, 2006·19 cites·45 claims
- 0652US7135353B2Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured therebySAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Nov 14, 2006·5 cites·8 claims
- 0752US7096914B2Apparatus for bonding a chip using an insulating adhesive tapeSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Aug 29, 2006·6 cites·19 claims
- 0844US2008026506A1Semiconductor multi-chip package and fabrication methodSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 0932US2006105477A1Device and method for manufacturing wafer-level packageLIM SUK-KUN·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →