Inventor · disambiguated record
Chiwoo Lee
Also filed as: LEE CHIWOO
3 granted patents·9 pending applications·1 citations·filing 2019–2025
49Inventor score
Files withSAMSUNG ELECTRONICS CO LTD8BIOWAY INC2BEIJING ESWIN COMPUTING TECH CO LTD1SAMSUNG RO YEONGTONG GU1
Top patents by PatentIndex Score
12 records- 0177US12046589B2Display apparatus having display module and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 23, 2024·1 cites·20 claims
- 0260US2025183243A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0359US2025158001A1Chip structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0458US2025079424A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0558US2025157996A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0657US12505775B1Display driver, method for driving display, chip and electronic deviceBEIJING ESWIN COMPUTING TECH CO LTD·Filed 2024·Granted Dec 23, 2025·0 cites·20 claims
- 0757US2025149519A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0856US2025391388A1Display apparatus and control method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0954US10577369B2Substituted quinazolinones for inhibiting PI3KBIOWAY INC·Filed 2019·Granted Mar 3, 2020·0 cites·13 claims
- 1042US2024063085A1Thermal interfacial material film, semiconductor package, method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1140US2020148684A1Substituted Quinazolinones For Inhibiting PI3KBIOWAY INC·Filed 2020·Application pending·0 cites
- 1239US2024120266A1Semiconductor package including conductive antioxidant layerSAMSUNG RO YEONGTONG GU·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →