Inventor · disambiguated record
Changbo Lee
Also filed as: LEE CHANGBO
8 granted patents·12 pending applications·34 citations·filing 2007–2024
78Inventor score
Top patents by PatentIndex Score
20 records- 0189US8288060B2Metal-supported solid oxide fuel cell and manufacturing method thereofBAE JOONGMYEON·Filed 2009·Granted Oct 16, 2012·32 cites·12 claims
- 0273US11121090B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 14, 2021·2 cites·19 claims
- 0373US2025096181A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0469US12199060B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·18 claims
- 0560US11682648B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 20, 2023·0 cites·16 claims
- 0657US11694965B2Fan-out semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 0754US2025008749A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0854US2024297122A1Semiconductor package and method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0952US2024321722A1Semiconductor package, and redistribution substrate for semiconductor package and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1052US2010021779A1Solid oxide fuel cell system integrated with reformerKOREA ADVANCED INST SCI & TECH·Filed 2009·Application pending·0 cites
- 1151US2024038740A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1251US2010186220A1Fabrication method of metal supported solid oxide fuel cellKOREA ADVANCED INST SCI & TECH·Filed 2009·Application pending·0 cites
- 1350US2011104584A1Metal supported solid oxide fuel cellKOREA ADVANCED INST SCI & TECH·Filed 2009·Application pending·0 cites
- 1449US12237252B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 1549US2024194577A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1649US2024021530A1Semiconductor package including connection layerJEON YOONYOUNG·Filed 2023·Application pending·0 cites
- 1748US8153331B2Fabrication method of anode and electrolyte in solid oxide fuel cellBAE JOONGMYEON·Filed 2007·Granted Apr 10, 2012·0 cites·14 claims
- 1848US2010062302A1Metal support and solid oxide fuel cell including the sameBAE JOONGMYEON·Filed 2009·Application pending·0 cites
- 1947US2009035635A1Combination Structure Between Single Cell and Interconnect of Solid Oxide Fuel CellKOREA ADVANCED INST SCI & TECH·Filed 2007·Application pending·0 cites
- 2045US11462466B2Fan-out type semiconductor packages and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →