Inventor · disambiguated record
Chungsun Lee
Also filed as: LEE CHUNGSUN
33 granted patents·24 pending applications·155 citations·filing 2005–2025
95Inventor score
Top patents by PatentIndex Score
57 records- 0195US8759147B2Semiconductor packages and methods of fabricating the sameCHOI EUN-KYOUNG·Filed 2011·Granted Jun 24, 2014·57 cites·18 claims
- 0293US12218102B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 4, 2025·3 cites·20 claims
- 0393US11996358B2Semiconductor packages having first and second redistribution patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 28, 2024·2 cites·18 claims
- 0493US8928132B2Semiconductor package having through silicon via (TSV) interposer and method of manufacturing the semiconductor packageCHOI YUNSEOK·Filed 2011·Granted Jan 6, 2015·42 cites·39 claims
- 0589US10157766B2Method of fabricating a semiconductor deviceKANG UN BYOUNG·Filed 2014·Granted Dec 18, 2018·13 cites·19 claims
- 0688US9023716B2Methods for processing substratesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 5, 2015·8 cites·19 claims
- 0786US12512427B2Semiconductor device including lower pads having different widths and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·1 cites·19 claims
- 0886US11705323B2Wafer trimming deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 18, 2023·2 cites·20 claims
- 0983US2025336798A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1082US8105934B2Bump structure for a semiconductor device and method of manufactureKWON YONGHWAN·Filed 2009·Granted Jan 31, 2012·15 cites·11 claims
- 1182US2025343146A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1281US12368093B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 1381US9006081B2Methods of processing substratesAHN JUNG-SEOK·Filed 2012·Granted Apr 14, 2015·6 cites·8 claims
- 1479US2025364282A1Molding apparatus of semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1578US11335719B2Semiconductor package including an image sensor chip and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 17, 2022·1 cites·20 claims
- 1676US12381151B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 1776US9412636B2Methods for processing substratesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Aug 9, 2016·2 cites·20 claims
- 1874US2025105181A1Semiconductor device, semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1973US12014977B2Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 2073US9059072B2Semiconductor packages and methods of fabricating the sameCHOI EUN-KYOUNG·Filed 2014·Granted Jun 16, 2015·3 cites·4 claims
- 2171US12476180B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 2271US11824076B2Semiconductor package including an image sensor chip and a method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 21, 2023·0 cites·19 claims
- 2371US2024290702A1Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2471US2024312923A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2570US12394641B2Molding apparatus of semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 2670US2024404972A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2767US12199056B2Semiconductor device, semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 14, 2025·0 cites·20 claims
- 2867US11664312B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·0 cites·19 claims
- 2964US11637058B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 25, 2023·0 cites·19 claims
- 3063US12451474B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·19 claims
- 3163US12021034B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 25, 2024·0 cites·20 claims
- 3263US11923309B2Semiconductor package including fine redistribution patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 3363US11688679B2Interconnection structure, method of fabricating the same, and semiconductor package including interconnection structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·17 claims
- 3463US2025167178A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 3562US12009288B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·19 claims
- 3659US11854893B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 3759US2024222331A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3859US2024186277A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3958US12094847B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·19 claims
- 4058US2024120251A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4157US12224256B2Wafer structure and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·20 claims
- 4257US2024055414A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4357US2024194639A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4456US2024088092A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4555US2024178202A1Semiconductor devices including bonded semiconductor layers and manufacturing methods of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4653US12456627B2Dry etching apparatus and wafer etching system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 4753US2024213109A1Semiconductor package with semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4853US2024170449A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4952US2023420336A1Fan-out type semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 5051US2024157481A1Semiconductor chip splitting method using a laser and semiconductor chip split by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →