Inventor · disambiguated record
Chun-Yang Lee
Also filed as: LEE CHUN-YANG
4 granted patents·3 pending applications·82 citations·filing 1997–2011
76Inventor score
Top patents by PatentIndex Score
7 records- 0187US7055861B1BookmarkLEE CHUN-YANG·Filed 2000·Granted Jun 6, 2006·46 cites·4 claims
- 0258US5904374ACover member with foldable bookmark flapFiled 1997·Granted May 18, 1999·24 cites·12 claims
- 0342US2005282311A1Flip-chip substrate and flip-chip bonding process thereofCHEN YU-WEN·Filed 2005·Application pending·0 cites
- 0440US6357797B1Book coverFiled 1999·Granted Mar 19, 2002·12 cites·5 claims
- 0537US2007194436A1Ball grid array packageADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 0636US2004119171A1[flip-chip substrate and flip-chip bonding process thereof]Filed 2003·Application pending·0 cites
- 0726US8629541B2Semiconductor package for controlling warpageOU MIN-SHIN·Filed 2011·Granted Jan 14, 2014·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →