Inventor · disambiguated record
Chin Chung Lee
Also filed as: LEE CHIN CHUNG
3 granted patents·4 citations·filing 2000–2021
54Inventor score
Top patents by PatentIndex Score
3 records- 0152US11894284B2Semiconductor structure having silver-indium transient liquid phase bonding jointLIGHT MED USA INC·Filed 2021·Granted Feb 6, 2024·0 cites·7 claims
- 0244US6397664B1Method and apparatus for detecting leakage in a flow control valveTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jun 4, 2002·4 cites·20 claims
- 0337US11373925B2Silver-indium transient liquid phase method of bonding semiconductor device and heat-spreading mount and semiconductor structure having silver-indium transient liquid phase bonding jointLIGHT MED USA INC·Filed 2019·Granted Jun 28, 2022·0 cites·31 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →