Inventor · disambiguated record
Cheng-Hui Lee
Also filed as: LEE CHENG-HUI
3 granted patents·1 pending application·96 citations·filing 2000–2015
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0182US6614660B1Thermally enhanced IC chip packageULTRATERA CORP·Filed 2002·Granted Sep 2, 2003·67 cites·4 claims
- 0270US6190943B1Chip scale packaging methodUNITED TEST CT INC·Filed 2000·Granted Feb 20, 2001·26 cites·3 claims
- 0333USD784297SEarphoneDONGGUAN SHANGHAO ELECTRONICS CO LTD·Filed 2015·Granted Apr 18, 2017·3 cites·1 claims
- 0433US2004004281A1Semiconductor package with heat sinkFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →