Inventor · disambiguated record
Chan Kim Lee
Also filed as: LEE CHAN KIM
5 granted patents·3 pending applications·9 citations·filing 2012–2022
69Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0177US8890302B2Hybrid package transmission line circuitsKONG CHUNG PENG JACKSON·Filed 2012·Granted Nov 18, 2014·6 cites·23 claims
- 0253US9543244B2Hybrid package transmission line circuitsINTEL CORP·Filed 2014·Granted Jan 10, 2017·0 cites·22 claims
- 0352US2024006399A1Die-stacked and molded architecture for memory on package (mop)INTEL CORP·Filed 2022·Application pending·0 cites
- 0451US11482481B2Semiconductor device and systemINTEL CORP·Filed 2020·Granted Oct 25, 2022·0 cites·11 claims
- 0551US2024071948A1Semiconductor package with stiffener basket portionINTEL CORP·Filed 2022·Application pending·0 cites
- 0646US11096284B2Compact semiconductor chip system and methodINTEL CORP·Filed 2019·Granted Aug 17, 2021·0 cites·16 claims
- 0746US2023397333A1Ultra-laser though hole (ulth) by multi-stacked core conceptINTEL CORP·Filed 2022·Application pending·0 cites
- 0834USD759029SComputer on a stickINTEL CORP·Filed 2015·Granted Jun 14, 2016·3 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →