Inventor · disambiguated record
Chien-Chang Lee
Also filed as: LEE CHIEN C · LEE CHIEN-CHANG
40 granted patents·24 pending applications·205 citations·filing 1998–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD45WINTEK CORP4CATERPILLAR INC3LOGITECH EUROP SA2LOGITECH EUROPE SA2
Top patents by PatentIndex Score
64 records- 0198US11855130B2Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·9 cites·17 claims
- 0298US11728288B2Semiconductor die including guard ring structure and three-dimensional device structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 15, 2023·5 cites·20 claims
- 0397US12027475B2Semiconductor die including guard ring structure and three-dimensional device structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 2, 2024·3 cites·20 claims
- 0493US11892678B2Photonic device and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 0593US9762279B2Adjustable protective cover for an input deviceLOGITECH EUROPE SA·Filed 2015·Granted Sep 12, 2017·12 cites·12 claims
- 0690US11175452B1Photonic device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 16, 2021·2 cites·20 claims
- 0790USD761798SAdjustable protective cover for an input deviceLOGITECH EUROP SA·Filed 2015·Granted Jul 19, 2016·32 cites·1 claims
- 0890US2025349757A1Semiconductor Die Including Guard Ring Structure and Three Dimensional Device Structure Including the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0989US11327228B2Photonic device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 10, 2022·2 cites·20 claims
- 1089US6175484B1Energy recovery circuit configuration for solenoid injector driver circuitsCATERPILLAR INC·Filed 1999·Granted Jan 16, 2001·60 cites·15 claims
- 1187US12417987B2Semiconductor die including guard ring structure and three-dimensional device structure including the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 16, 2025·0 cites·20 claims
- 1284US7675595B2Liquid crystal display panel having rectangular liquid crystal domain arranging layers including crossed slitsWINTEK CORP·Filed 2007·Granted Mar 9, 2010·8 cites·11 claims
- 1383US12272724B2Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·0 cites·20 claims
- 1483US2024387618A1Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1581USD744491SAdjustable protective cover for an input deviceLOGITECH EUROP SA·Filed 2014·Granted Dec 1, 2015·21 cites·1 claims
- 1681US2025110283A1Optical coupling systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1781US2025085476A1Photonic device and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1880US12169308B2Method of using fiber to chip coupler and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 17, 2024·0 cites·20 claims
- 1980US12094925B1Three-dimensional device structure including embedded integrated passive device and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 2080US2025203893A1Three-dimensional device structure including substrate-embedded integrated passive device and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2179US12278167B2Semiconductor die including through substrate via barrier structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 2279US12153255B2Method of making photonic deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 26, 2024·0 cites·20 claims
- 2379US12050348B2Fiber to chip coupler and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 2479US2024363682A1Three-dimensional device structure including embedded integrated passive device and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2578US7586568B2Liquid crystal display panel and liquid crystal display device incorporating the sameWINTEK CORP·Filed 2007·Granted Sep 8, 2009·5 cites·19 claims
- 2678US2024361532A1Fiber to chip coupler and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2777US6363913B1Solid state lift for micrometering in a fuel injectorCATERPILLAR INC·Filed 2000·Granted Apr 2, 2002·18 cites·23 claims
- 2877US2025210468A1Semiconductor die including through substrate via barrier structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2976US2023358959A1Photonic deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3076US2025316649A1Three-dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3175US2024321654A1Three-dimensional device structure including seal ring connection circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3274US11740409B2Photonic deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 29, 2023·0 cites·20 claims
- 3373US2024395639A1Semiconductor package including test line structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3473US2024304700A1Deep trench capacitor including a compact contact region and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3572US12463099B2Semiconductor package including test line structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 3672US12072534B2Fiber to chip coupler and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·20 claims
- 3772US11908838B2Three-dimensional device structure including embedded integrated passive device and methods of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 3872US11892681B2Fiber to chip coupler and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
- 3971US12322679B2Semiconductor die including through substrate via barrier structure and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 3, 2025·0 cites·20 claims
- 4070US12261133B2Interposer with warpage-relief trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Mar 25, 2025·0 cites·20 claims
- 4170US2023378154A1Shielded deep trench capacitor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4270US2023378051A1Capacitor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4369US10063268B2Portable electronic device supportLOGITECH EUROPE SA·Filed 2015·Granted Aug 28, 2018·3 cites·17 claims
- 4466US11776896B2Capacitor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 4565US12040242B2Three-dimensional device structure including seal ring connection circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·20 claims
- 4664US12362323B2Three-dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 15, 2025·0 cites·20 claims
- 4763US12094868B2Shielded deep trench capacitor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·0 cites·20 claims
- 4862US12009405B2Deep trench capacitor including a compact contact region and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 4962US2025380911A1Method to establish vital sign prediction models and applications thereofUNIV NAT TAIWAN HOSPITAL·Filed 2024·Application pending·0 cites
- 5061US9151798B2Method and apparatus for testing a semiconductor deviceSHAO JHIH JIE·Filed 2011·Granted Oct 6, 2015·2 cites·20 claims
Showing the top 50 of 64 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →