Inventor · disambiguated record
Chun-Che Lee
Also filed as: LEE CHUN-CHE
18 granted patents·2 pending applications·172 citations·filing 1998–2022
92Inventor score
Files withADVANCED SEMICONDUCTOR ENG9UNIV NAT SUN YAT SEN3NAT SUN YAT-SEN UNIV2APPELT BERND KARL1CHAN CHENG-WEI1
Top patents by PatentIndex Score
20 records- 0196US9406658B2Embedded component device and manufacturing methods thereofLEE CHUN-CHE·Filed 2010·Granted Aug 2, 2016·107 cites·16 claims
- 0286US8884443B2Substrate for semiconductor package and process for manufacturingADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 11, 2014·6 cites·13 claims
- 0385US7910395B2LED structureHELIO OPTOELECTRONICS CORP·Filed 2006·Granted Mar 22, 2011·19 cites·24 claims
- 0483US10181438B2Semiconductor substrate mitigating bridgingADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Jan 15, 2019·4 cites·26 claims
- 0578US8987407B2Fuel cell catalyst layer having sulfonated poly(arylene ether)s and manufacturing method thereofUNIV NAT SUN YAT SEN·Filed 2014·Granted Mar 24, 2015·2 cites·11 claims
- 0677US9209472B2Polymer of sulfonated poly(arylene ether)s and manufacturing method thereofUNIV NAT SUN YAT SEN·Filed 2015·Granted Dec 8, 2015·1 cites·6 claims
- 0776US9117697B2Semiconductor substrate and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Aug 25, 2015·4 cites·20 claims
- 0874US9018336B2Polymer of sulfonated poly(arlene ether)s and manufacturing method thereofUNIV NAT SUN YAT SEN·Filed 2014·Granted Apr 28, 2015·1 cites·3 claims
- 0970US2022359361A1Semiconductor substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Application pending·0 cites
- 1068US9437532B2Substrate for semiconductor package and process for manufacturingADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Sep 6, 2016·1 cites·20 claims
- 1167US8143770B2LED bulb structure having insertion end, and/or heat dissipation element, and/or heat-and-electricity separated elementCHAN CHENG-WEI·Filed 2006·Granted Mar 27, 2012·10 cites·17 claims
- 1265US9224707B2Substrate for semiconductor package and process for manufacturingADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Dec 29, 2015·1 cites·30 claims
- 1360US9748594B2Polymer of fluorine-containing sulfonated poly(arylene ether)s and method of manufacturing the sameNAT SUN YAT-SEN UNIV·Filed 2017·Granted Aug 29, 2017·0 cites·7 claims
- 1460US8309400B2Leadframe package structure and manufacturing method thereofAPPELT BERND KARL·Filed 2010·Granted Nov 13, 2012·1 cites·21 claims
- 1559US11398421B2Semiconductor substrate and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Jul 26, 2022·0 cites·20 claims
- 1656US9644069B2Polymer of fluorine-containing sulfonated poly(arylene ether)s and method of manufacturing the sameNAT SUN YAT-SEN UNIV·Filed 2015·Granted May 9, 2017·0 cites·3 claims
- 1748US5982625ASemiconductor packaging deviceADVANCED SEMICONDUCTOR ENG·Filed 1998·Granted Nov 9, 1999·15 cites·20 claims
- 1844US8720053B2Process of fabricating a circuit boardLEE SHIH-CHANG·Filed 2009·Granted May 13, 2014·0 cites·12 claims
- 1943US10049976B2Semiconductor substrate and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Aug 14, 2018·0 cites·20 claims
- 2028US2001048999A1Reinforced flexible substrates and method thereforFiled 1998·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →