Inventor · disambiguated record

Chi-Ping Lei

Also filed as: LEI CHI-PING

2 granted patents·1 pending application·0 citations·filing 2019–2024

29Inventor score

Technology areasH10P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD3

Top patents by PatentIndex Score

3 records

0170US2024371708A1Systems and methods for suction pad assembliesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
0265US12087646B2Systems and methods for suction pad assembliesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
0354US11328965B2Systems and methods for suction pad assembliesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 10, 2022·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →