Inventor · disambiguated record
Ching-Hohn Len
Also filed as: LEN CHING-HOHN
1 granted patent·1 pending application·0 citations·filing 2019–2020
10Inventor score
Files withSFI ELECTRONICS TECH INC2
Top patents by PatentIndex Score
2 records- 0159US11404209B2Electrical device package structure and manufacturing method thereofSFI ELECTRONICS TECH INC·Filed 2020·Granted Aug 2, 2022·0 cites·13 claims
- 0235US2020411470A1Package method for attached single small size and array type of chip semiconductor componentSFI ELECTRONICS TECH INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →