Inventor · disambiguated record
Chi Ho Leung
Also filed as: LEUNG CHI HO
12 granted patents·11 pending applications·40 citations·filing 2014–2024
87Inventor score
Top patents by PatentIndex Score
23 records- 0189US9391007B1Built-up lead frame QFN and DFN packages and method of making thereofNXP BV·Filed 2015·Granted Jul 12, 2016·10 cites·10 claims
- 0286US10410941B2Wafer level semiconductor device with wettable flanksNexperia BV·Filed 2016·Granted Sep 10, 2019·6 cites·18 claims
- 0386US9640463B2Built-up lead frame package and method of making thereofNexperia BV·Filed 2015·Granted May 2, 2017·7 cites·7 claims
- 0483US9443791B2Leadless semiconductor package and methodNXP BV·Filed 2015·Granted Sep 13, 2016·7 cites·15 claims
- 0577US9425130B2Package with multiple I/O side-solderable terminalsNXP BV·Filed 2014·Granted Aug 23, 2016·7 cites·13 claims
- 0671US10304759B2Electronic device and method of making sameNexperia BV·Filed 2016·Granted May 28, 2019·2 cites·4 claims
- 0762US2025105206A1Method of and intermediate for manufacturing a semiconductor die packageNexperia BV·Filed 2024·Application pending·0 cites
- 0861US10262926B2Reversible semiconductor dieNexperia BV·Filed 2016·Granted Apr 16, 2019·1 cites·13 claims
- 0959US2025174526A1Semiconductor packageNexperia BV·Filed 2024·Application pending·0 cites
- 1057US2024096769A1Method for manufacturing a semiconductor package assembly as well as a semiconductor package assembly obtained with this methodNexperia BV·Filed 2023·Application pending·0 cites
- 1154US2023146666A1Electronic package and method for manufacturing the sameNexperia BV·Filed 2022·Application pending·0 cites
- 1254US2025006576A1Method of manufacturing semiconductor assembliesNexperia BV·Filed 2024·Application pending·0 cites
- 1350US2024006276A1Method of manufacturing semiconductor package assembly and a semiconductor package assembly manufactured using this methodNexperia BV·Filed 2023·Application pending·0 cites
- 1449US2023134075A1Semiconductor package and method for producing the sameNexperia BV·Filed 2022·Application pending·0 cites
- 1547US10658274B2Electronic deviceNexperia BV·Filed 2018·Granted May 19, 2020·0 cites·14 claims
- 1637US9947632B2Semiconductor device and method of making a semiconductor deviceNexperia BV·Filed 2016·Granted Apr 17, 2018·0 cites·15 claims
- 1735US2016126169A1Leadless semiconductor device and method of making thereofNXP BV·Filed 2014·Application pending·0 cites
- 1834US10256168B2Semiconductor device and lead frame thereforNexperia BV·Filed 2016·Granted Apr 9, 2019·0 cites·19 claims
- 1934US2017170103A1Electronic device and manufacturing method thereforNexperia BV·Filed 2016·Application pending·0 cites
- 2034US2017256432A1Overmolded chip scale packageNexperia BV·Filed 2016·Application pending·0 cites
- 2133US10529644B2Semiconductor deviceNexperia BV·Filed 2016·Granted Jan 7, 2020·0 cites·15 claims
- 2230US9634739B2Wireless communication system and method thereofX ON COMMUNICATIONS LTD·Filed 2014·Granted Apr 25, 2017·0 cites·16 claims
- 2330US2018151482A1Electronic device, manufacturing method and lead frame for sameNexperia BV·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →