Inventor · disambiguated record
Ching-Chih Li
Also filed as: LI CHING-CHIH
11 granted patents·7 pending applications·25 citations·filing 2003–2025
85Inventor score
Top patents by PatentIndex Score
18 records- 0179US7880297B2Semiconductor chip having conductive member for reducing localized voltage dropMEDIATEK INC·Filed 2008·Granted Feb 1, 2011·10 cites·17 claims
- 0275US9846756B2Layout method for printed circuit boardMEDIATEK INC·Filed 2015·Granted Dec 19, 2017·2 cites·28 claims
- 0367US7816610B2Layout circuitMEDIATEK INC·Filed 2007·Granted Oct 19, 2010·4 cites·17 claims
- 0467US7486105B2Memory systems and memory access methodsMEDIATEK INC·Filed 2007·Granted Feb 3, 2009·4 cites·26 claims
- 0566US8525310B2Leadframe package for high-speed data rate applicationsCHEN NAN-JANG·Filed 2011·Granted Sep 3, 2013·2 cites·11 claims
- 0666US2023125573A1Device for testing chip or die with better system ir dropMEDIATEK INC·Filed 2022·Application pending·0 cites
- 0765US8283757B2Quad flat package with exposed common electrode barsCHEN NAN-CHENG·Filed 2010·Granted Oct 9, 2012·2 cites·21 claims
- 0860US11573264B2Device for testing chip or die with better system IR dropMEDIATEK INC·Filed 2020·Granted Feb 7, 2023·0 cites·11 claims
- 0957US9978692B2Integrated circuit, electronic device and method for transmitting data in electronic deviceMEDIATEK INC·Filed 2016·Granted May 22, 2018·1 cites·26 claims
- 1057US2025165670A1Automatic check method and deviceMEDIATEK INC·Filed 2024·Application pending·0 cites
- 1146US8258615B2Semiconductor device and fabricating method thereofCHANG SHENG-MING·Filed 2009·Granted Sep 4, 2012·0 cites·18 claims
- 1245US2009020859A1Quad flat package with exposed common electrode barsMEDIATEK INC·Filed 2008·Application pending·0 cites
- 1344US7561481B2Memory controllers and pad sequence control methods thereofMEDIATEK INC·Filed 2007·Granted Jul 14, 2009·0 cites·11 claims
- 1442US2025364386A1Electronic device and layout checking methodMEDIATEK INC·Filed 2025·Application pending·0 cites
- 1539US2004174807A1Method for co-layout of different buses in an electric boardFiled 2003·Application pending·0 cites
- 1638US2009187874A1Circuit and circuit design methodMEDIATEK INC·Filed 2008·Application pending·0 cites
- 1737US10581414B2Semiconductor integrated circuit deviceMEDIATEK INC·Filed 2016·Granted Mar 3, 2020·0 cites·6 claims
- 1832US2016218092A1Chip package with embedded passive deviceMEDIATEK INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →