Inventor · disambiguated record
Chi-Hsueh Li
Also filed as: LI CHI HSUEH
10 granted patents·16 pending applications·0 citations·filing 2020–2024
76Inventor score
Files withPANJIT INT INC26
Top patents by PatentIndex Score
26 records- 0163US11916030B2Method for manufacturing side wettable packagePANJIT INT INC·Filed 2022·Granted Feb 27, 2024·0 cites·4 claims
- 0262US11848254B2Method for manufacturing a semiconductor package having a conductive pad with an anchor flangePANJIT INT INC·Filed 2021·Granted Dec 19, 2023·0 cites·7 claims
- 0362US2025125292A1Side-wettable package with edge-recessed bond padsPANJIT INT INC·Filed 2024·Application pending·0 cites
- 0460US11562947B2Semiconductor package having a conductive pad with an anchor flangePANJIT INT INC·Filed 2020·Granted Jan 24, 2023·0 cites·7 claims
- 0560US11387203B2Side wettable packagePANJIT INT INC·Filed 2020·Granted Jul 12, 2022·0 cites·4 claims
- 0657US12288737B2Thin semiconductor packaging unit having a plurality of bridging layersPANJIT INT INC·Filed 2022·Granted Apr 29, 2025·0 cites·16 claims
- 0757US12224228B2Packaged component with composite pin structure and manufacturing method thereofPANJIT INT INC·Filed 2022·Granted Feb 11, 2025·0 cites·14 claims
- 0857US2025107117A1Schottky diode with low reverse current and high heat dissipation effectPANJIT INT INC·Filed 2023·Application pending·0 cites
- 0956US12408407B2Metal oxide semiconductor with multiple drain viasPANJIT INT INC·Filed 2022·Granted Sep 2, 2025·0 cites·6 claims
- 1056US2025120008A1Package capable of eliminating bubble formationPANJIT INT INC·Filed 2023·Application pending·0 cites
- 1156US2025112130A1Flat semiconductor package with coplanar leadsPANJIT INT INC·Filed 2023·Application pending·0 cites
- 1255US2025212372A1Power supply unit with improved space utilization and heat dissipationPANJIT INT INC·Filed 2024·Application pending·0 cites
- 1355US2024355716A1Side-wettable semiconductor package device with heat dissipation surface structurePANJIT INT INC·Filed 2023·Application pending·0 cites
- 1453US2024355703A1Heat dissipative semiconductor packagePANJIT INT INC·Filed 2023·Application pending·0 cites
- 1552US2024030155A1Wafer level chip scale package unitPANJIT INT INC·Filed 2022·Application pending·0 cites
- 1652US2025239499A1Ultra-thin packaged componentPANJIT INT INC·Filed 2024·Application pending·0 cites
- 1752US2024112943A1Die suction assistance devicePANJIT INT INC·Filed 2022·Application pending·0 cites
- 1852US2024128185A1Semiconductor device and pre-forming adaptor thereofPANJIT INT INC·Filed 2022·Application pending·0 cites
- 1951US11664345B2Semiconductor package elementPANJIT INT INC·Filed 2021·Granted May 30, 2023·0 cites·6 claims
- 2051US2024120241A1Packaging device capable of detecting risk of impact of electrostatic chargesPANJIT INT INC·Filed 2022·Application pending·0 cites
- 2147US11594425B2Semiconductor package structure and fabricating method of the samePANJIT INT INC·Filed 2020·Granted Feb 28, 2023·0 cites·8 claims
- 2247US2022406620A1Fabricating method for wafer level semiconductor package device and the fabricated semiconductor package devicePANJIT INT INC·Filed 2021·Application pending·0 cites
- 2345US12148675B2Power semiconductor package unit of surface mount technology including a plastic film covering a chipPANJIT INT INC·Filed 2021·Granted Nov 19, 2024·0 cites·14 claims
- 2444US2023395553A1Package device preventing solder overflowPANJIT INT INC·Filed 2022·Application pending·0 cites
- 2543US2022157707A1Thin semiconductor package and manufacturing method thereofPANJIT INT INC·Filed 2020·Application pending·0 cites
- 2643US2023395465A1Semiconductor package with solderable sidewallPANJIT INT INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →