Inventor · disambiguated record
Cheng-Chieh Li
Also filed as: LI CHENG · LI CHENG-CHIEH
8 granted patents·6 pending applications·11 citations·filing 2014–2025
79Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7IND TECH RES INST2ACADEMIA SINICA1HUAWEI TECH CO LTD1JANE WIN SHIH LIU1
Top patents by PatentIndex Score
14 records- 0190US11502056B2Joint structure in semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 0289US11164855B2Package structure with a heat dissipating element and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·6 cites·20 claims
- 0385US12368132B2Joint structure in semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 0485US2025309188A1Joint structure in semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0577US12087727B2Joint structure in semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 0677US11152330B2Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 19, 2021·2 cites·20 claims
- 0760US9906920B2Building design information based indoor positioning systemACADEMIA SINICA·Filed 2017·Granted Feb 27, 2018·1 cites·15 claims
- 0854US2025172726A1Light-transmitting plate, mechanical part, and photosensitive apparatusHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 0953US2024038616A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1053US2025093271A1Thermal drift calibrated microcavities and systems using optical frequency domain reflectometryUNIV ARIZONA·Filed 2023·Application pending·0 cites
- 1152US2016163950A1Structure of thermoelectric module and fabricating method thereofIND TECH RES INST·Filed 2014·Application pending·0 cites
- 1249US2018040798A1Structure of thermoelectric module and fabricating method thereofIND TECH RES INST·Filed 2017·Application pending·0 cites
- 1340US11226708B2Touch electrode, touch panel, and touch display of using the sameTPK ADVANCED SOLUTIONS INC·Filed 2021·Granted Jan 18, 2022·0 cites·19 claims
- 1431US10747192B2Installation position pointer systemJANE WIN SHIH LIU·Filed 2017·Granted Aug 18, 2020·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →