Inventor · disambiguated record
Chin-Jui Liang
Also filed as: LIANG CHIN-JUI
2 granted patents·4 pending applications·0 citations·filing 2021–2024
22Inventor score
Top patents by PatentIndex Score
6 records- 0152US12224221B2Packaging method and package structureHARVATEK CORP·Filed 2022·Granted Feb 11, 2025·0 cites·10 claims
- 0252US11699675B2Semiconductor device with high heat dissipation efficiencyHARVATEK CORP·Filed 2021·Granted Jul 11, 2023·0 cites·14 claims
- 0348US2025361624A1Conductive substrate having high thermal conductivityCMTEK CO LTD·Filed 2024·Application pending·0 cites
- 0445US2023215786A1Planar multi-chip deviceHARVATEK CORP·Filed 2022·Application pending·0 cites
- 0545US2023215785A1Vertical type multi-chip deviceHARVATEK CORP·Filed 2022·Application pending·0 cites
- 0642US2025362097A1Heat spreader, manufacturing method thereof, and porous carrier thereofCMTEK CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →